WMSIC Electronic Components

YONGYUTAI YLED0805B

ModelYLED0805B
Package0805
BrandYONGYUTAI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YONGYUTAI YLED0805B
Type
YONGYUTAI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YONGYUTAI
Electronic Component
YLED0805B
Electronic Component
1
Package
0805
Electronic Component
457nm~475nm
Electronic Component
LEDDiode / LED
Electronic Component
0.026g
Electronic Component
1
LED
80mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0225803655
Operating Temperature
40℃~+85℃
Current
25mA
Diode
Diode

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YLED0805B(0805)产品概述

YLED0805B 是永裕泰(YONGYUTAI)推出的一款微型表面贴装蓝色发光二极管(LED),采用0805封装,单颗独立二极管结构,针对消费电子、小型指示与背光等场合设计。体积小巧、视角宽广、色光稳定,适合自动化贴装与高密度电路板应用。

一、主要特性

  • 发光颜色:蓝色
  • 波长范围:457 nm ~ 475 nm(典型蓝光波段)
  • 封装形式:0805(典型外形尺寸约 2.0 mm × 1.25 mm)
  • 二极管配置:独立单颗二极管
  • 典型发光强度:约 80 mcd(在常见驱动条件下,如 IF ≈ 20 mA)
  • 正向电流(IF):最大 25 mA(推荐不超过额定值以保证寿命)
  • 正向压降(Vf):2.7 V ~ 3.1 V(随电流与温度略有变化)
  • 发光角度:120°(宽视角,适合指示与面发光)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 品牌:YONGYUTAI(永裕泰)

二、光电与电气参数(概要)

  • 波长:457–475 nm,显示为纯正蓝光,适用于需要较高色纯度的指示及视觉效果场合。
  • 发光强度:约 80 mcd,指示类用途亮度充足;如需更高亮度,请采用并联或更高功率型号。
  • 正向电流:额定上限 25 mA;为延长寿命及降低热量,推荐常用驱动电流在 10–20 mA 范围。
  • 正向压降:2.7–3.1 V,设计驱动电路时请按最大值预留余量并考虑温度漂移。

注:具体光电数据常与测试电流、测试条件有关,设计时建议参考厂家完整数据手册或实测样品数据。

三、封装与机械特性

  • 尺寸:0805(公制约 2.0 mm × 1.25 mm),适配常见 SMT 贴片工艺。
  • 极性标识:0805 封装通常在器件或托盘上有极性标记;实际使用请以厂商数据手册或实物极性标识为准。
  • 装带方式:常见为卷带(Tape & Reel),便于自动贴片机取料。

四、环境与可靠性

  • 工作温度:-40 ℃ ~ +85 ℃,适用于大多数室温与工业温度场合。
  • 存储与湿度:建议干燥包装并在制造商建议的条件下存放,避免潮湿导致回流焊时器件受潮裂纹或焊点缺陷。
  • ESD:LED 对静电敏感,装配与搬运请采取静电防护措施(佩戴防静电手环、使用防静电工作台等)。

五、安装与焊接建议

  • 贴片焊接:采用标准回流焊工艺,建议遵循 JEDEC/IPC 推荐的回流温度曲线;避免多次暴露在高温条件下以延长器件寿命。
  • 焊盘设计:请参照厂商推荐的 PCB 布局与焊盘尺寸以获得最佳焊接可靠性与光学效果,保持适当的锡膏量与焊接均匀性。
  • 回流注意:预热、保温、峰值与冷却阶段需合理控制,防止热冲击;回流后建议短时间内完成清洗与检查。

六、典型应用

  • 面板与指示灯:家电、仪表、工控设备的状态指示。
  • 消费电子:遥控器、耳机、便携设备指示灯与装饰照明。
  • 仪器仪表与交通设备:低功耗指示、信号反馈灯。
  • 背光与图形显示:在需要小面积蓝光点阵或混色应用中作为蓝色光源使用。

七、驱动与电路建议

  • 恒流驱动优先:为保证亮度一致性与延长寿命,推荐使用恒流驱动器或在串联电路中加入限流电阻。
  • 串联限流电阻计算公式:R = (Vsup − Vf) / If
    • 例:若电源 5 V、目标 IF = 20 mA、取 Vf ≈ 2.9 V,则 R ≈ (5 − 2.9) / 0.02 ≈ 105 Ω(可选择 100 Ω 或 110 Ω 常规阻值,并考虑功耗)。
  • 若电源电压变化大或需精确亮度控制,采用专用恒流 LED 驱动芯片更为稳妥。

八、注意事项与订购信息

  • 注意器件极性与 PCB 焊盘方向,避免误装产生损坏。
  • 遵守最大正向电流与功耗限制,长期过流会导致亮度衰减或失效。
  • 订购时请提供完整型号 YLED0805B、颜色(Blue)、封装(0805)、数量与包装方式(如卷带)以便厂商正确发货。
  • 如需大量采购或用于关键应用(如医疗、航空等),建议向厂方索取详细的数据手册、可靠性报告与样品进行验证。

总结:YLED0805B 是一款适合高密度 SMT 板、指示与小型背光场景的常规蓝光 0805 LED。凭借宽视角(120°)、稳定蓝色波长与适度亮度(≈80 mcd),在自动贴装与标准电路设计中易于集成。实际应用中请根据系统电源、驱动方式与热管理作相应设计与验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.