Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YONGYUTAI 1N5819
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YONGYUTAI 1N5819
- Type
- YONGYUTAI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YONGYUTAI
- Electronic Component
- 1N5819
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.024g
- Electronic Component
- 1
- Electronic Component
- BM0264770666
- Current
- 350mA
- Diode
- 1
- Current(Ir)
- 5uA@30V
- (Vf)
- 600mV@200mA
- Electronic Component
- 65℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1N5819 产品概述
一、产品简介
YONGYUTAI（永裕泰）生产的 1N5819 为一款小型表贴肖特基二极管，封装为 SOD-523，主打低正向压降和高速切换特性。器件适用于便携式电源、开关电源的续流、整流与反向保护电路，兼顾体积小、功率损耗低与可靠性要求。
二、主要参数
- 二极管配置：1 个独立式
- 正向压降（Vf）：600 mV @ 200 mA
- 直流反向耐压（Vr）：40 V
- 整流电流（平均）：350 mA
- 反向电流（Ir）：5 μA @ 30 V
- 工作结温范围：-65 ℃ ~ +125 ℃
- 非重复峰值浪涌电流（Ifsm）：2 A
- 封装：SOD-523（超小型表贴）
- 品牌：YONGYUTAI（永裕泰）
三、主要特性与优势
- 低正向压降：在中小电流工况下（200 mA），Vf 约为 0.6 V，减少功率损耗与发热，有利于提高系统效率。
- 低反向泄漏：30 V 时反向电流仅 5 μA，有助于降低静态功耗，适合电池供电应用。
- 小型封装：SOD-523 适合高密度 PCB 布局与移动设备，节省空间。
- 良好的浪涌能力：2 A 非重复峰值浪涌可应对短时启动/浪涌事件。
- 宽温度范围：-65 ℃ 至 +125 ℃，满足工业级温度要求。
四、典型应用场景
- 便携式电池供电设备的反向保护或续流二极管；
- 低功耗 DC-DC 转换器输出整流与续流；
- 电源路径选择与肖特基隔离；
- 小信号整流与保护电路，适用于消费电子、通信终端与物联网模块。
五、封装与可靠性建议
SOD-523 为薄小型表贴封装，贴装时需注意回流焊曲线与热量管理，避免过度加热导致封装应力或焊点失效。在高密度布板和高电流路径中，应评估敷铜面积与散热条件，确保结温不超过额定上限。
六、选型与使用注意
- 如果电路电流长期接近 350 mA，应评估 Vf 带来的功耗并考虑更大额定电流的替代品；
- 对于需承受频繁大浪涌或高瞬态电流的场合，若 Ifsm 要求高于 2 A，应选用更高浪涌能力的封装或并联方案（并联时需注意电流均分）；
- 焊接时遵循厂商推荐的回流曲线，避免重复高温应力；存储与使用环境应避免潮湿与高温，以维护长期可靠性。
七、结论
YONGYUTAI 的 1N5819（SOD-523）是一款面向空间受限、注重低正向压降与低泄漏的肖特基二极管，适合便携设备与低功耗电源路径保护。在选型时需关注长期电流、散热条件与浪涌要求，以确保满足实际应用的可靠性与性能指标。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
