WMSIC Electronic Components

BZT52C5V6

ModelBZT52C5V6
PackageSOD-123
BrandYONGYUTAI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YONGYUTAI BZT52C5V6
Type
YONGYUTAI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YONGYUTAI
Electronic Component
BZT52C5V6
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.031g
Electronic Component
1
(Zzk)
400Ω
(Zzt)
40Ω
Electronic Component
BM0226337742
Diode
1
Current(Ir)
1uA@1V
Power Dissipation(Pd)
500mW
Electronic Component
5.2V~6V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C5V6(5.6V)稳压二极管 — 产品概述

一、主要参数概览

BZT52C5V6 是一款常用的低功耗稳压二极管,适用于小功率稳压与电压钳位场合。来自 YONGYUTAI(永裕泰)品牌,封装为 SOD-123(贴片)。关键电气参数如下:

  • 稳压值(标称):5.6 V
  • 标称范围:5.2 V ~ 6.0 V(生产公差与批次差异导致实际Vz在此区间内)
  • 最大耗散功率 Pd:500 mW(在规定散热条件下)
  • 反向漏电流 IR:≤1 μA(厂商资料常以 Vr=1.0 V 或 Vr=2.0 V 为测试条件)
  • 低电流/静态阻抗 Zzk:400 Ω(低电流区的近似阻抗特性)
  • 测试/稳压阻抗 Zzt:40 Ω(在规定测试电流下的动态阻抗)
  • 封装:SOD-123(表面贴装),适合自动贴装与小尺寸电路板

二、封装与热管理要点

SOD-123 为小体积表面贴装封装,便于在空间受限的电路中使用,但其热阻相对较高,散热能力受限。因此在使用时必须考虑功率降额与热管理:

  • 计算最大允许稳流:Iz_max ≈ Pd / Vz = 0.5 W / 5.6 V ≈ 89 mA(理论值)。注意:此为封装在良好散热条件下的理论极限,不适合作为长期连续工作电流。
  • 推荐连续工作电流:为了长期可靠性,建议将稳流控制在 10–20 mA 范围内;若有间歇或脉冲工作,可允许更高瞬时电流,但需确保平均功耗不超 Pd。
  • 布板建议:在二极管附近增加铜箔面积以改善散热,避免将器件包裹在阻热材料中;通过合理走线与散热过孔可显著提升持续功耗能力。

三、典型电路与选型计算

BZT52C5V6 通常作为并联稳压(分流稳压)元件使用,常见接法为反向并联在负载上,配合串联限流电阻 Rs 形成简易稳压电路。关键公式:

  • Rs = (Vin - Vz) / Iz(用于设定稳流 Iz)
  • 二极管功耗 Pd_di = Vz × Iz
  • 限流电阻功耗 Pd_R = (Vin - Vz) × Iz

举例说明:若 Vin = 12 V,目标 Iz = 20 mA,则 Rs = (12 − 5.6) / 0.02 = 320 Ω;二极管功耗 ≈ 5.6 × 0.02 = 0.112 W;限流电阻功耗 ≈ 6.4 × 0.02 = 0.128 W。此时二极管功耗远低于 500 mW,可长期使用;但若 Iz 接近上限,二极管功耗将快速上升,应避免长期运行于高功率点。

四、应用场景与限制

适用场合:

  • 小功率参考电压源(偏置、基准点)
  • 输入保护与电压钳位(抑制尖峰或反向过压)
  • 小型模拟/数字电路的局部稳压与基准电压
  • 信号线防浪涌、保护敏感器件

限制与注意:

  • 不是高功率主稳压器,不适合替代线性稳压芯片用于大电流供电。
  • 由于Vz有制造公差(5.2–6.0V),不适合对精密电压要求极高的场合,若精度高应选用精密基准或配用后端调整。
  • 低电流区阻抗较大(Zzk≈400 Ω),在微安级电流下稳压精度较差。
  • 高阻抗电路对微安级漏电流敏感时,应评估漏电流对系统的影响。
  • 对浪涌与ESD需额外保护:作为 TVS 并不能替代专用 TVS 器件对大能量冲击的保护能力。

五、选型建议与换型参考

  • 若需要在相同电压档位下更好热特性或更高功率,考虑更大封装或功率二极管(例如 SMB/SMC 等表面贴装功率封装)。
  • 若对稳压精度和温漂有更高要求,可选用专用基准二极管或带温度补偿的参考源。
  • BZT52 系列是通用型号,市面上多家厂家提供相同规格器件,YONGYUTAI 的 BZT52C5V6 在性价比与供应方面具有竞争力。

总结:BZT52C5V6(5.6V,500 mW,SOD-123)是一款适合小功率稳压与钳位用途的通用稳压二极管。设计时重点关注工作电流、散热与制造公差,合理限流并进行降额设计可获得长期可靠的工作状态。如需更详细的典型曲线或温度特性,请参阅厂家完整数据手册或联系供应商获取样品测试数据。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.