WMSIC Electronic Components

DTC143ZE

ModelDTC143ZE
PackageSOT-523
BrandYONGYUTAI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YONGYUTAI DTC143ZE
Type
YONGYUTAI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YONGYUTAI
Electronic Component
DTC143ZE
Electronic Component
1
Package
SOT-523
Electronic Component
1 NPN
Electronic Component
Digital Transistor
Electronic Component
0.025g
Electronic Component
1
Electronic Component
BM0226337751
Operating Temperature
55℃~+150℃
Resistor
0.1
Resistor
4.7kΩ
Transistor Type
NPN
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DTC143ZE 产品概述

一、主要规格

DTC143ZE 是永裕泰(YONGYUTAI)出品的一颗 NPN 预偏置数字晶体管,适合直接由逻辑电平驱动小功率负载。主要参数如下:直流电流增益 hFE = 200(Ic = 5mA, Vce = 10V);内置输入电阻 = 4.7 kΩ;电阻比率 = 0.1(厂商参数);集射极击穿电压 Vceo = 50 V;最大集电极电流 Ic = 100 mA;耗散功率 Pd = 150 mW;工作结温范围 -55 ℃ ~ +150 ℃(Tj)。封装为超小型 SOT-523,单元为预偏置 NPN(1 个)。

二、功能与主要特点

  • 预偏置设计:内置输入电阻(4.7 kΩ),可直接与 MCU 或 TTL/CMOS 输出直连,无需外加基极电阻,简化驱动电路。
  • 高增益:hFE = 200(低电流区),便于在较小输入电流下驱动中低电流负载。
  • 宽耐压与小型化:Vceo = 50 V 与 SOT-523 超小封装,适用于空间受限但需一定耐压的电路。
  • 低功耗、小体积:Pd = 150 mW,适合信号级放大、LED 驱动与接口隔离等场景。

三、典型应用场景

  • MCU/逻辑电平到外设的驱动(指示灯、开关管驱动前级)。
  • 小电流继电器或有源蜂鸣器驱动(注意总电流与能耗限制)。
  • 电平转换与开关控制(如将 3.3V/5V 输出用于控制更高电压侧的负载)。
  • 信号放大与逻辑隔离、开漏替代电路。

四、设计与使用要点

  • 直接驱动:以 5V 输入为例,基极电流约 (Vin − Vbe)/4.7k ≈ (5 − 0.7)/4.7k ≈ 0.91 mA。按 hFE = 200,该基极电流在线性区可支持远超 Ic 的集电极电流,但实际开关状态下需考虑饱和和安全裕量。
  • 饱和裕量:数字晶体管内置电阻便于直连,但若需驱动接近最大 Ic(100 mA)的负载,建议外部限流或并联驱动器以减小器件应力;并留意功耗 Pd 与 PCB 散热能力。
  • 热管理:SOT-523 封装体积小,Pd 受 PCB 铜箔面积和环境限制影响大;在长期工作或高占空比下应进行功耗计算并做热降额。
  • 引脚与封装:SOT-523 为三引脚小封装,典型引脚为 B、C、E(为确保无误,请以厂家封装图或样片标识为准)。
  • ESD 与焊接:小型封装对静电和焊接热冲击敏感,推荐采用符合厂商推荐的回流曲线与防静电措施。

五、选型与注意事项

  • 若负载电流常态接近或超过几十毫安,优先验证温升与功耗是否满足 Pd 限制;必要时选择更大功率封装或外加功率器件。
  • 样片评估时请参考完整数据手册,确认 Vce(sat)、Ic-温度特性与开关速度等关键指标。
  • SOT-523 的体积优势明显,适合高密度 PCB,但手工焊接和检测难度较大,建议在量产前做好工艺验证。

六、品牌与采购

DTC143ZE 由 YONGYUTAI(永裕泰)提供,适合需要预偏置、无需外部基极电阻且对体积有严格要求的消费类与工业类电子产品。购买与开发前建议索取并阅读完整规格书以便进行准确设计验证。

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