WMSIC Electronic Components

Ymin VKME1451H331MV

ModelVKME1451H331MV
PackageSMD,10x14.5mm
BrandYMIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Ymin VKME1451H331MV
Type
YMIN
Minimum package
350 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YMIN
Electronic Component
VKME1451H331MV
Electronic Component
1
Electronic Component
330uF
Package
SMD,10x14.5mm
Electronic Component
SMD Aluminum Electrolytic Capacitor
Electronic Component
±20%
Electronic Component
2.457g
Electronic Component
1
Electronic Component
BM0265637835
Electronic Component
10000hrs@105℃
Operating Temperature
55℃~+105℃
Voltage
50V
Capacitor
10mm
Capacitor
14.5mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

VKME1451H331MV 贴片铝电解电容产品概述

一、产品核心定位与品牌背景

VKME1451H331MV是永铭电子(Ymin) 推出的一款中高压贴片铝电解电容,属于通用型滤波/储能器件,主打小型化、宽温适应性、长寿命三大核心优势,适配工业控制、通信设备、消费电子等对可靠性有要求的场景。永铭作为国内电解电容领域的主流品牌,其产品以“性能稳定+成本可控”著称,这款型号是其贴片电解系列中的经典款之一。

二、关键电气性能参数详解

1. 容值与精度

标称容值为330μF(型号中“331”为容值编码,代表33×10¹μF),精度±20%——符合铝电解电容的常规精度标准,无需额外高精度匹配,可满足多数电路对滤波、储能的误差需求。

2. 额定电压

直流额定电压50V,实际工作电压建议控制在额定值的80%以内(即≤40V),避免过压导致电容老化加速或击穿,适配中等功率电路的电压范围。

3. 电气稳定性

在额定工作条件下,容值衰减速率、漏电流等参数符合行业标准,长期运行中性能波动小,可降低设备故障风险。

三、机械封装与安装特性

1. 封装形式

采用SMD(表面贴装)封装,适配自动化SMT生产线,无需手工焊接,生产效率高,适合批量制造。

2. 尺寸规格

电容体直径10mm,长度14.5mm(D10×L14.5mm),属于紧凑型贴片电解,可节省PCB布局空间,适配高密度集成设备(如小型通信模块、工业控制器)。

3. 安装要求

电解电容为有极性器件,安装时需核对电容负极侧的白色条纹标识与PCB极性标记(通常为“+”“-”或丝印),反向安装会导致电容瞬间损坏。

四、环境适应性与可靠性表现

1. 工作温度范围

覆盖**-55℃~+105℃**宽温区间,可适配:

  • 低温场景(如北方户外设备、低温工业现场);
  • 高温场景(如密闭机箱内、高温环境下的电源模块),无需额外散热/保温设计。

2. 工作寿命

10000小时@105℃——属于长寿命级别(普通贴片电解通常为2000~5000小时@105℃),可支持设备7×24小时长期运行(如UPS电源、通信基站)。

3. 可靠性验证

经过高低温循环、湿热老化、振动测试等行业标准验证,性能稳定,可降低设备故障率。

五、典型应用场景分析

  1. 工业电源模块:中等功率(10~50W)开关电源的滤波环节,适配50V以内输出电压,宽温特性适应工业现场温度波动;
  2. 通信设备:基站、路由器等的电源滤波电路,贴片封装适配高密度PCB,长寿命满足7×24小时运行需求;
  3. 消费电子:显示器、机顶盒、智能家电的电源部分,330μF容值可有效滤除电源纹波,提升设备稳定性;
  4. 小型工业控制:PLC、传感器模块的储能电路,宽温范围适应现场环境变化;
  5. LED驱动电源:多串LED驱动的滤波环节,50V额定电压适配高压驱动需求。

六、选型与使用注意事项

  1. 电压匹配:实际工作电压≤40V(额定值80%),避免过压;
  2. 温度适配:若环境温度超过105℃,需更换更高温级电容;低于-55℃需确认低温性能(本型号低温性能良好);
  3. 回流焊适配:符合行业标准回流焊曲线(峰值温度≤260℃,时间≤10秒),避免高温损坏电容;
  4. 极性确认:安装前务必核对极性,反向安装会导致电容失效。

VKME1451H331MV凭借紧凑尺寸、宽温长寿命的优势,成为中高压贴片电解市场的高性价比选择,可满足多数电子设备的滤波/储能需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.