WMSIC Electronic Components

ZD24C128A-SSGMB

ModelZD24C128A-SSGMB
PackageSOP8 150mil
BrandZETTA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Zetta ZD24C128A-SSGMB
Type
ZETTA
Minimum package
20000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ZETTA
Electronic Component
ZD24C128A-SSGMB
Electronic Component
1
Package
SOP8 150mil
Electronic Component
EEPROM
Electronic Component
0.234g
Electronic Component
1
Features
Built-in positions(POR)
Electronic Component
BM0264678812
Electronic Component
128Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
1MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZD24C128A-SSGMB 产品概述

一、产品简介

ZD24C128A(Zetta 澜智)是一款容量为128Kbit(16,384 × 8)的I2C兼容串行EEPROM,专为需要高可靠性、长数据保持及低电压应用场景设计。器件支持最高1MHz的I2C时钟频率(Fast-mode Plus),可在宽电压范围1.7V至5.5V下稳定工作,并在-40℃至+85℃工业级温度范围内可靠运行。器件封装为SOP8 150mil,适合通用贴片安装。

二、主要特性

  • 存储容量:128Kbit(16,384 × 8)
  • 接口类型:I2C(最高 fc = 1MHz)
  • 页写模式:64字节/页,单次写入效率高
  • 写周期时间(Tw):典型 5ms
  • 写周期寿命:1,000,000 次(高耐久)
  • 数据保留(TDR):100 年
  • 工作电压:1.7V ~ 5.5V(支持低电压系统)
  • 工作温度:-40℃ ~ +85℃
  • 封装:SOP8 150mil
  • 功能特性:内置上电复位(POR)、硬件写保护(WP)、噪声抑制功能

三、引脚与接口(常见说明)

SOP8 封装的常见引脚功能包括:

  • VCC:电源输入(1.7V~5.5V)
  • GND:地
  • SDA:数据线(I2C 双向)
  • SCL:时钟线
  • WP:写保护输入(硬件写保护)
  • A0/A1/A2:器件地址/可选硬件地址引脚(具体请参照数据手册) 说明:I2C 总线需外部上拉电阻,建议根据系统电压与总线长度选择合适阻值(常见范围 2kΩ~10kΩ)。器件内部具备噪声抑制与上电复位功能,有助于系统上电与电磁干扰条件下的数据完整性。

四、典型使用建议

  • 电源去耦:在VCC与GND之间并联0.1µF陶瓷电容,靠近器件引脚布置,以抑制瞬态噪声。
  • 总线上拉:为SDA和SCL配置合适的上拉电阻;对于1.8V和低速应用可选较大阻值(如10kΩ),对于高频或长总线建议使用较小阻值(如2kΩ~4.7kΩ)。
  • 页写操作:利用64字节页写可显著提高写入效率。单次页写长度不超过64字节,若跨页需分段写入并等待内部写周期完成(Tw)。
  • 写完成检测:写入后可通过ACK轮询(主机发送器件地址并监测ACK)或等待Tw时间(典型5ms)来确认写周期结束,避免在设备内部写操作期间继续访问。
  • 写保护:当WP引脚为有效电平时,可将EEPROM置入硬件写保护,防止意外写入。设计时应规划好WP的接法(常闭/常开或由MCU控制)。

五、可靠性与优势

  • 超长数据保持:100年数据保留,适合需长期保存配置信息与校准参数的应用。
  • 高写入寿命:1,000,000次写周期,适用于频繁更新的数据记录或计数器场景。
  • 宽电压与工业温度范围:1.7V5.5V及-40℃+85℃使其可在多种平台与恶劣工作环境中使用。
  • 抗干扰与上电保护:内置噪声抑制与上电复位,提高系统可靠性与数据完整性。

六、典型应用场景

  • 工业控制:参数存储、设备序列号与校准数据
  • 消费电子:设置备份、用户偏好与设备配置
  • 物联网与智能终端:固件配置、密钥/凭证存储(非高安全密钥)、传感器校准
  • 仪器仪表与医疗设备:长期保存校准系数与配置
  • 网络设备与通信模块:MAC地址、设备参数等永久存储

七、选型与封装信息

型号:ZD24C128A-SSGMB 品牌:Zetta(澜智) 封装:SOP8 150mil 在选型时请确认封装、温度等级和是否需带有特定出厂测试或标识。若需BOM中替代或量产支持,可联系供应商确认可用封装与供货形式(卷带、托盘等)。

八、使用注意事项

  • 在多从机I2C总线中,确保器件地址与其他从设备不冲突,必要时使用地址引脚(A0~A2)进行区分。
  • 写保护功能在关键数据保护场景下应启用或由主控在关键时刻控制,从而避免软件或总线故障导致的数据破坏。
  • 对于安全/加密密钥等敏感信息,若对抗物理读取有更高要求,应选用具备加密/防篡改功能的专用器件。

ZD24C128A-SSGMB以其高耐久、高可靠性和广泛电压兼容性,为需要长期可靠存储的系统提供了稳健的解决方案。若需电气时序图、完整引脚排列或典型应用电路,请参阅详细数据手册或联系澜智技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.