WMSIC Electronic Components

ZD24C128A-XGMB

ModelZD24C128A-XGMB
PackageTSSOP-8
BrandZETTA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Zetta ZD24C128A-XGMB
Type
ZETTA
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ZETTA
Electronic Component
ZD24C128A-XGMB
Electronic Component
1
Package
TSSOP-8
Electronic Component
EEPROM
Electronic Component
0.2g
Electronic Component
1
Features
Built-in positions(POR)
Electronic Component
BM0264678833
Electronic Component
128Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
1MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZD24C128A-XGMB EEPROM产品概述

一、产品核心定位与基础属性

ZD24C128A-XGMB是澜智(Zetta)半导体推出的128Kbit串行EEPROM,专为小容量非易失性数据存储、低功耗运行及宽环境适应性场景设计。作为I2C接口存储器件,它兼具高速通信、高可靠性与成本优势,可替代多款同容量竞品,适配工业控制、消费电子、物联网终端等多领域需求。

二、关键性能参数解析

(一)存储容量与通信速率

产品容量为128Kbit(换算为16KB),满足大多数场景下的配置参数、设备ID、校准数据等小容量存储需求;I2C接口支持最高1MHz时钟频率,属于高速I2C模式,相比传统100kHz标准模式,数据传输速度提升10倍,可显著缩短系统通信响应时间。

(二)电压与功耗适配性

工作电压范围覆盖1.7V~5.5V,兼容主流微控制器的IO电压(如3.3V、5V),同时支持低功耗1.8V系统,适合纽扣电池、锂电池供电的便携/低功耗设备;写操作时电压范围稳定,无额外升压电路需求,简化系统设计。

(三)写操作与数据可靠性

  • 写周期时间(Tw)仅5ms,比同类型竞品的10ms~20ms更快,可提升系统写操作效率;
  • 写周期寿命达100万次,是普通EEPROM(通常10万次)的10倍,适合频繁写操作的日志存储、状态记录等场景;
  • 数据保留时间(TDR)为100年,即使设备长期断电(如闲置设备、备份存储),数据仍能稳定保存,无需担心数据丢失。

三、封装与电路兼容性

采用TSSOP-8封装,体积小巧(尺寸约3mm×4.4mm),适合高密度贴片焊接,节省PCB空间;引脚布局符合标准I2C EEPROM的8脚定义(含A0-A2地址脚、SDA/SCL通信脚、WP写保护脚、VCC/GND电源脚),可直接兼容现有同容量EEPROM的电路设计,无需修改硬件布局,降低系统升级成本。

四、典型应用场景

ZD24C128A-XGMB的宽温特性(-40℃~+85℃)与低功耗设计,使其适配多场景:

  1. 工业控制领域:存储PLC、传感器的校准参数、设备配置,适应车间高低温环境;
  2. 物联网终端:如智能门锁、环境监测节点,存储WiFi配置、设备ID,支持电池供电;
  3. 消费电子:智能家居设备(如智能音箱、路由器)存储网络参数,便携设备(如智能手环)存储用户设置;
  4. 医疗设备:低功耗监护仪、血糖仪等,存储患者数据、设备日志,满足医疗级可靠性要求。

五、可靠性与环境适应性

  • 宽工作温度:-40℃~+85℃,覆盖工业级环境温度范围,可在户外、车间等 harsh 场景稳定运行;
  • 写保护功能:WP引脚支持硬件写保护,防止误操作导致数据篡改,提升系统可靠性;
  • 抗干扰性:I2C接口具备噪声抑制能力,适合电磁环境复杂的工业场景。

综上,ZD24C128A-XGMB凭借高性价比、宽适配性与高可靠性,成为中小容量非易失性存储的优选器件,可快速融入各类电子系统设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.