WMSIC Electronic Components

ZD24C64A-XGMT

ModelZD24C64A-XGMT
PackageTSSOP8
BrandZETTA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Zetta ZD24C64A-XGMT
Type
ZETTA
Minimum package
3000 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ZETTA
Electronic Component
ZD24C64A-XGMT
Electronic Component
1
Package
TSSOP8
Electronic Component
EEPROM
Electronic Component
0.173g
Electronic Component
1
Features
Built-in positions(POR)
Electronic Component
BM0264500214
Electronic Component
64Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
1MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZD24C64A-XGMT 64Kbit I2C接口EEPROM产品概述

ZD24C64A-XGMT是澜智(Zetta)半导体推出的一款工业级64Kbit电可擦除可编程只读存储器(EEPROM),采用标准I2C串行接口设计,兼具宽电压兼容性、高速通信能力与高可靠性,可满足工业控制、消费电子、IoT等多场景的参数存储需求。

一、核心参数精准定义

ZD24C64A-XGMT的核心参数围绕“稳定存储+灵活适配”设计,关键指标如下:

  • 存储容量:64Kbit(即8192字节),支持字节级擦写与页级批量写入(页大小16字节),适配不同数据量的存储需求;
  • 接口类型:标准I2C串行接口,支持双向数据传输,内置3位地址引脚(A0/A1/A2),最多可级联8个设备,简化多设备系统布线;
  • 通信速率:最高1MHz时钟频率(fc),是普通I2C(400kHz)的2.5倍,可大幅提升数据读写效率,减少系统响应延迟;
  • 工作电压:1.7V~5.5V超宽范围,覆盖从低功耗1.8V MCU(如STM32L系列)到传统5V系统(如8位单片机),无需额外电平转换电路;
  • 写周期特性:单字节写周期时间(Tw)仅5ms,比同类产品(通常10ms)快一倍,可快速完成参数更新;
  • 寿命与可靠性:写周期寿命达100万次(符合JEDEC JESD22标准),数据保留时间(TDR)100年,长期存储无数据丢失风险;
  • 工作温度:-40℃~+85℃工业级温度范围,适应户外传感器、车间PLC等恶劣环境;
  • 封装形式:TSSOP-8超薄小外形封装,引脚间距0.65mm,尺寸约4.4mm×3.0mm,节省PCB空间。

二、关键性能优势解析

ZD24C64A-XGMT的性能优势源于参数与设计的协同优化:

  1. 宽电压覆盖:1.7V~5.5V电压范围可适配几乎所有主流MCU,避免因电压不匹配导致的系统故障,降低BOM成本;
  2. 高速通信:1MHz时钟频率支持快速批量数据传输,例如写入1页(16字节)数据仅需约16μs(不含写周期),适合实时性要求高的场景;
  3. 工业级可靠性:-40℃~+85℃温度范围+100万次写周期,可稳定运行于工业现场(如温度波动的车间、户外监测站),数据可靠性经长期测试验证;
  4. 小体积集成:TSSOP-8封装适合紧凑型设计,例如智能手环、蓝牙耳机等便携式设备,无需额外扩展空间;
  5. 低功耗设计:写周期仅5ms,待机状态功耗极低(典型值<1μA),适合电池供电的IoT设备(如无线传感器节点),延长电池寿命。

三、典型应用场景适配

ZD24C64A-XGMT的参数特性使其适配多领域应用:

  • 工业控制:存储PLC、伺服电机的校准参数、传感器节点的ID与阈值,适应-40℃~+85℃的车间/户外环境;
  • 消费电子:智能穿戴(存储心率监测阈值、用户设置)、智能家居(存储设备配对信息、定时参数);
  • IoT设备:无线传感器节点(存储采集间隔、节点位置)、智能门锁(存储用户密码、开锁记录);
  • 通信设备:路由器、交换机(存储MAC地址、固件版本、网络配置);
  • 汽车电子(扩展场景):车载传感器(如胎压监测的校准数据,若需扩展至汽车级温度可联系澜智定制)。

四、封装与可靠性验证

  • TSSOP-8封装:表面贴装工艺,引脚布局紧凑,可通过自动化贴装设备高效生产,降低制造成本;
  • 可靠性测试:通过高低温循环测试(-40℃~+85℃,循环1000次)、写周期寿命测试(100万次无故障)、数据保留测试(100年存储验证),符合工业级产品标准。

ZD24C64A-XGMT凭借“宽电压+高速+高可靠+小体积”的综合优势,成为多领域存储方案的优选,澜智半导体提供持续的供货保障与技术支持,可满足客户的批量生产与定制化需求。

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