Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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ZD24C02B-MAGMT是澜智(Zetta)推出的小容量高可靠性串行EEPROM,主打低功耗、宽电压兼容与工业级稳定性,核心定位为需要“小数据量长期存储”且对体积、寿命敏感的场景。不同于大容量存储芯片,其2Kbit(256字节)容量刚好匹配“设备校准参数、用户设置、设备ID”等典型需求,无需占用过多资源,同时平衡成本与性能。
存储容量为2Kbit(即256字节),采用标准I2C串行接口,支持最高1MHz时钟频率,兼容I2C快速模式(400kHz)与标准模式(100kHz),可直接对接主流MCU(如STM32、ATmega系列),无需额外电平转换(电压覆盖1.7-5.5V)。
数据保留时间(TDR)达100年,远超行业10-20年的平均水平——即使设备长期断电(如待机10年以上),存储的校准参数、用户设置仍能完整保留,避免数据丢失风险。
采用UDFN-8L(2×3mm)超小封装,体积仅为传统DIP-8封装的1/5,是同类产品中体积最小的方案之一。这种封装适合PCB空间极度紧张的场景:比如可穿戴设备(智能手环、蓝牙耳机)、小型物联网节点、微型传感器模块等,能有效减少设备体积,提升便携性。
工作电压覆盖1.7V~5.5V,兼容3.3V、5V主流系统,同时支持低电压1.7V(电池供电设备的典型电压下限),适合电池供电的物联网终端、低功耗可穿戴设备,即使电池电量下降也能稳定工作。
工作温度为-40℃~+125℃,符合工业级标准,可在 harsh环境(如户外传感器、工业PLC模块、车载小模块)中稳定运行,避免因温度变化导致的存储异常。
ZD24C02B-MAGMT的性能特点使其在多个领域具备竞争力:
ZD24C02B-MAGMT通过“小容量+高可靠性+超小封装+宽环境适应性”的组合,精准匹配中端存储需求。其100万次写寿命、100年数据保留、5ms写周期等核心参数,解决了同类产品“寿命短、数据易丢、写入慢”的痛点,是澜智针对工业、消费电子、物联网等领域推出的高性价比串行EEPROM方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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