WMSIC Electronic Components

ZD25WD20CTIGT

ModelZD25WD20CTIGT
PackageSOP-8
BrandZETTA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Zetta ZD25WD20CTIGT
Type
ZETTA
Minimum package
20000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ZETTA
Electronic Component
ZD25WD20CTIGT
Electronic Component
1
Package
SOP-8
Electronic Component
NOR FLASH
Electronic Component
1.47g
Electronic Component
1
Electronic Component
BM0264500217
Electronic Component
2Mbit
Operating Voltage
1.65V~3.6V
Current
0.5uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
104MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZD25WD20CTIGT 产品概述

一、产品简介

ZD25WD20CTIGT 是澜智(Zetta)推出的一款 SPI NOR Flash 存储器,容量 2Mbit(256KB),工作电压宽范围 1.65V ~ 3.6V,支持高达 104MHz 的 SPI 时钟频率,封装为 SOP-8-150mil,提供 Tape & Reel 自动贴片包装,适合嵌入式固件存储、代码与参数保存等场景。

二、主要规格参数

  • 接口类型:SPI(串行外围接口)
  • 存储容量:2 Mbit(256 KB)
  • 最大时钟频率 (fc):104 MHz
  • 工作电压:1.65 V ~ 3.6 V(单电源宽压兼容)
  • 待机电流:0.5 μA(典型,低功耗待机)
  • 擦写寿命(P/E cycles):100,000 次
  • 页写入时间 (Tpp):2 ms(典型)
  • 块擦除时间 (tBE):13 ms(典型)
  • 数据保留 (TDR):20 年
  • 封装:SOP-8 150mil,Tape & Reel

三、关键特性与优势

  • 宽电压兼容:1.65–3.6V 的供电范围支持 1.8V 与 3.3V 系统,无需外部电平转换,利于多种平台集成。
  • 高速读取:104MHz 的 SPI 时钟满足快速代码执行与数据传输需求,适用于启动加速和快速引导。
  • 低功耗:0.5μA 的待机电流在电池供电或节能系统中可显著降低待机能耗。
  • 高可靠性:10万次擦写寿命与 20 年的数据保留保证固件与关键配置长期可靠性,适合工业与消费级产品。
  • 经济封装:SOP-8-150mil 便于手工/自动装配与替换测试,Tape & Reel 满足量产贴片工艺。

四、典型应用场景

  • MCU/SoC 的外部代码或引导程序储存(Boot ROM)
  • 工业控制、仪表的参数与校准数据保存
  • 物联网终端、可穿戴设备的固件及日志存储(注重低功耗)
  • 消费电子产品的配置与版本管理

五、设计与使用建议

  • 电源与去耦:在 VCC 引脚附近放置 0.1μF 陶瓷去耦电容,靠近器件以抑制瞬态干扰。
  • 上电/断电顺序:遵循芯片数据手册的建议电源上/下电序,避免在未稳定的电压下进行写/擦操作。
  • 写入管理:考虑引导时的写保护与校验机制(CRC/校验和),以降低因写入中断导致的固件损坏风险。
  • 温度与数据保持:长期高温环境会影响数据保留,请在系统设计时评估工作温度对 TDR 的影响并采取必要的散热或校验策略。
  • ESD 及封装处理:SOP-8 为表面贴装封装,贴装与回流时注意温度曲线,厂商资料中有详细焊接与回流指南。

六、封装与采购

ZD25WD20CTIGT 提供 SOP-8-150mil 封装,适用于自动化贴片生产,供应形式为 Tape & Reel。订购时请以完整料号及封装信息下单,并参照澜智官方数据手册确认电气时序、命令集及环境规范。

如需更详细的命令集、引脚定义、电气时序图或在特定系统(如 1.8V 单片机或电池供电终端)中的参考硬件设计,请提供目标应用场景或索取澜智 ZD25WD20CTIGT 的最新数据手册。

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