WMSIC Electronic Components

ZD25WD20CEIGR

ModelZD25WD20CEIGR
PackageDFN8 2x3x0.45mm
BrandZETTA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Zetta ZD25WD20CEIGR
Type
ZETTA
Minimum package
3000 原盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ZETTA
Electronic Component
ZD25WD20CEIGR
Electronic Component
1
Package
DFN8 2x3x0.45mm
Electronic Component
NOR FLASH
Electronic Component
0.042g
Electronic Component
1
Features
positions
Electronic Component
BM0264678797
Electronic Component
2Mbit
Operating Voltage
1.65V~3.6V
Current
0.5uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
104MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZD25WD20CEIGR 产品概述

一、产品简介

ZD25WD20CEIGR 是澜智(Zetta)推出的一款高性能 SPI NOR Flash 器件,存储容量 2Mbit(256KB),工作电压宽范围 1.65V ~ 3.6V,最高支持 104MHz 时钟频率。器件采用紧凑 DFN8(USON-8-EP,2×3×0.45mm)封装,适合空间受限的便携与嵌入式系统,提供 Tape&Reel 卷带供货,便于自动化贴片和量产装配。

二、主要技术参数

  • 存储容量:2 Mbit(256 KB)
  • 接口类型:SPI(串行外围接口)
  • 最大时钟频率(fc):104 MHz
  • 工作电压:1.65 V ~ 3.6 V(单电源)
  • 待机电流:0.5 μA(低功耗待机)
  • 页写入时间(Tpp):2 ms(典型)
  • 块擦除时间(tBE):13 ms(典型)
  • 擦写寿命:100,000 次
  • 数据保留(TDR):20 年
  • 关键特性:写使能锁存、软件写保护、上电复位(POR)
  • 封装:DFN8 2×3×0.45 mm(USON-8-EP)
  • 供货形式:Tape & Reel

三、功能与特性亮点

  • 低电压宽工作范围:1.65V 至 3.6V 的电源兼容性,使器件可直接用于多种低功耗系统和不同 I/O 电平平台。
  • 高速 SPI:支持高达 104MHz 的 SPI 时钟,满足快速代码或数据读取需求,降低系统启动时间。
  • 极低待机电流:0.5 μA 待机电流,有助于延长电池供电设备的待机时间。
  • 持久耐用:擦写寿命高达 100k 次,适合需要频繁更新固件或配置数据的场景。
  • 长期数据保持:20 年数据保留,适合长期可靠存储固件和关键参数。
  • 完善的写保护机制:支持写使能锁存和软件写保护,配合系统控制可防止误写或恶意篡改。
  • 上电复位:内置 POR,保证器件在电源稳定后再进入正常工作状态,提高系统可靠性。

四、典型应用场景

  • MCU 启动代码(Bootloader)、固件存储与更新(FOTA 前端存储)
  • 工业与消费类小容量代码和参数存储
  • IoT 设备与可穿戴终端的配置与日志存储
  • 嵌入式系统的序列号、校准数据、用户配置等非易失性存储
  • 需要低功耗待机与空间受限封装的移动与便携设备

五、设计与使用建议

  • 电源与去耦:建议在 VCC 与 GND 之间靠近器件放置 0.1 μF 陶瓷去耦电容,必要时并联较大容量电容以抑制瞬态电流。
  • SPI 信号完整性:对于高速(接近 104 MHz)设计,建议缩短 SPI 总线走线、使用合理阻抗匹配,并在必要位置加入小阻值串联电阻以改善信号反射。
  • 上电顺序与 POR:依赖器件内置上电复位(POR)保证安全启动,但系统设计时仍应避免在器件电源未稳定时进行总线操作。
  • 写保护策略:结合器件的软件写保护和系统级控制(如 GPIO 控制的写使能)制定多层写保护机制,以防止意外擦写或固件损坏。
  • 焊接工艺:DFN8 小封装对回流焊工艺敏感,请依照推荐回流曲线和 PCB 焊盘设计,以保证良好焊接可靠性与热性能。
  • 温度与老化:尽管器件具备良好数据保持能力,长期在极端温度下使用会影响寿命,建议在系统设计时留有安全裕度。

六、可靠性与封装信息

ZD25WD20CEIGR 的 DFN8(USON-8-EP)封装尺寸仅 2×3×0.45 mm,底部带接地垫(EP)有利于散热与电气接地。器件符合典型的闪存耐久与保持规范:擦写寿命 ≥ 100k 次,数据保留 ≥ 20 年。供货方式为 Tape & Reel,支持 SMT 贴装与自动化生产流程。

七、采购与支持

  • 品牌:Zetta(澜智)
  • 型号:ZD25WD20CEIGR
  • 封装/供货:DFN8 2×3×0.45 mm(USON-8-EP),Tape & Reel 如需获取完整数据手册、参考原理图或批量采购价格,请联系澜智授权分销商或本地技术支持,以获得最新规格、推荐焊接曲线和可靠性测试数据。

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