Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ZD24C02B-STGMT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Zetta ZD24C02B-STGMT
- Type
- ZETTA
- Minimum package
- 3000 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ZETTA
- Electronic Component
- ZD24C02B-STGMT
- Electronic Component
- 1
- Package
- SOT23_5
- Electronic Component
- EEPROM
- Electronic Component
- 0.053g
- Electronic Component
- 1
- Electronic Component
- BM0264678807
- Electronic Component
- 2Kbit
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 1.7V~5.5V
- Interface Type
- I2C
- Electronic Component
- 100
- Clock Frequency(fc)
- 1MHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ZD24C02B-STGMT 串行EEPROM产品概述
一、核心接口与通信特性
ZD24C02B-STGMT是澜智（Zetta）推出的I2C串行接口EEPROM，采用两线制通信架构——仅需SCL（时钟线）和SDA（数据线）即可完成数据交互，无需额外地址线，大幅简化系统硬件设计。其支持最高1MHz的时钟频率，相比常规I2C的400kHz传输速率提升一倍，能更快完成小容量数据的读写操作，适配对响应速度有要求的场景（如实时校准数据更新）。
二、存储容量与耐用性
该产品存储容量为2Kbit（256字节），属于小容量串行EEPROM范畴，精准匹配设备配置参数、校准系数、用户ID、状态标志等无需大量空间的关键数据存储需求。
耐用性方面优势显著：
- 写周期寿命达100万次：是普通EEPROM（通常10万次）的10倍，可应对频繁参数更新场景（如传感器定期校准、设备模式切换）；
- 写周期时间仅5ms：远快于同类产品10ms以上的标准，避免写入过程拖慢系统流程。
三、电气性能优势
3.1 宽电压工作范围
支持1.7V~5.5V的宽电压输入，覆盖从低功耗MCU（如1.8V供电的IoT节点）到传统5V系统的全场景，无需额外电压转换电路，兼容性极强，可直接适配不同供电架构的产品。
3.2 长期数据可靠性
数据保留时间（TDR）达100年，远超行业常规10~20年标准——即使设备长期断电（如工业设备待机、消费电子存储），存储的数据也能稳定保留，避免因数据丢失导致的设备重置或校准失效。
四、环境适应性
采用工业级温度范围（-40℃~+125℃），可在极端环境下稳定工作：
- 低温场景：工业现场冬季户外设备、汽车低温启动时的存储；
- 高温场景：太阳能逆变器、车载电子模块（发动机舱附近）等高温区域应用。
相比商业级（0℃~70℃）产品，更适合严苛环境的工业、汽车领域。
五、封装与应用场景
5.1 小体积封装
采用SOT23-5L封装，尺寸小巧（典型尺寸约2.9mm×1.6mm×1.1mm），可大幅节省PCB空间，适配可穿戴设备、小型传感器模块、物联网终端等对体积敏感的产品。
5.2 典型应用场景
- 工业控制：传感器节点的校准数据存储、PLC模块的配置参数；
- 汽车电子：车载显示屏的用户设置、胎压监测（TPMS）模块的ID存储；
- IoT终端：低功耗无线传感器的状态记录、智能家电的用户偏好存储；
- 消费电子：小型智能手环的用户信息、蓝牙耳机的配对记录。
六、总结
ZD24C02B-STGMT以“高耐用性、宽适应性、小体积”为核心优势，结合I2C高速接口、100万次写寿命、100年数据保留、工业级温度等特性，成为小容量串行EEPROM的高性价比选择，尤其适合对可靠性、环境适应性有要求的工业、汽车及IoT领域应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
