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ZD24C1MA-MAGMT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Zetta ZD24C1MA-MAGMT
- Type
- ZETTA
- Minimum package
- 3000 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ZETTA
- Electronic Component
- ZD24C1MA-MAGMT
- Electronic Component
- 1
- Package
- DFN8 2x3x0.45mm
- Electronic Component
- EEPROM
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0264678842
- Electronic Component
- 1Mbit
- Operating Temperature
- 40℃~+105℃
- Operating Voltage
- 1.7V~5.5V
- Interface Type
- I2C
- Electronic Component
- 100
- Clock Frequency(fc)
- 1MHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ZD24C1MA-MAGMT 产品概述
一、产品简介
ZD24C1MA-MAGMT 是澜智（Zetta）推出的一款高可靠性、超低功耗的串行 EEPROM，容量 1 Mbit（128 KiB），通过 I2C 兼容接口访问，最高支持 1 MHz 时钟。器件工作电压范围宽（1.7 V~5.5 V），工作温度覆盖工业级 -40℃ 至 +105℃，适合对数据长期保存和高耐久写入有要求的嵌入式系统应用。
二、主要规格与性能
- 存储容量：1 Mbit（128 KiB）。
- 接口类型：I2C 兼容，最高时钟频率 fc = 1 MHz（支持快速模式+）。
- 写周期时间：Tw = 5 ms（典型），在设计时需预留写完成等待时间。
- 数据保持：TDR = 100 年（典型）——适合长期保存配置与校准数据。
- 写入寿命：100 万次擦写周期，适合高频写入场景。
- 功能特性：硬件写保护（WP 引脚）与输入噪声抑制功能，可降低总线毛刺误触发风险。
- 工作电压：1.7 V ~ 5.5 V；工作温度：-40℃ ~ +105℃。
三、封装与电气接口
器件采用 UDFN-8L-EP（DFN8）小型封装，外形尺寸 2.0 × 3.0 × 0.45 mm，底部带散热/接地焊盘，适合贴片工艺与空间受限的产品设计。I2C 总线需配合适当的上拉电阻，推荐根据总线容量与速率选择合适阻值（高速时取较小阻值以保证上升时间）。
四、典型应用场景
- 工业控制与自动化：设备校准参数、配置表、历史记录存储。
- 物联网终端与传感节点：低功耗数据记录、设备唯一配置、固件参数存储。
- 工业与医疗测量仪器：长期校准与追溯数据保存。
- 消费类与便携设备：用户设置、日志与安全密钥等需要长期保持的数据。
五、设计与使用建议
- 写保护：对关键数据建议接入 WP 引脚并在不需要写入时拉低/拉高（依规格）以防止误写。
- 写入管理：尽管支持 100 万次写入，仍建议通过写缓冲、延迟合并或轮换策略降低不必要写入，延长系统寿命。
- 总线完整性：启用器件的噪声抑制功能并在 PCB 设计中注意信号线走向与去耦电容，以降低总线毛刺与 EMI 影响。
- 电源与序列：加装旁路电容（如 0.1 µF）于 VCC 与 GND，确保上电/断电时序稳定，避免写入中断导致的数据损坏。
- 时序与等待：每次写操作后遵循 Tw = 5 ms 的写完成时间，或通过读/ACK 检测写完成状态以提高效率。
六、小结
ZD24C1MA-MAGMT 以其宽电压、宽温度、超长期数据保持与高写入耐久性，配合硬件写保护与噪声抑制功能，适用于对可靠性和寿命有较高要求的嵌入式存储场景。其小型 DFN8 封装也便于空间受限的产品集成。若需深入的电气时序或封装资料，请参考澜智官方技术手册或联系授权分销商获取样片与评估板。
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