WMSIC Electronic Components

ZD24C02B-XGMT

ModelZD24C02B-XGMT
PackageTSSOP8
BrandZETTA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Zetta ZD24C02B-XGMT
Type
ZETTA
Minimum package
3000 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ZETTA
Electronic Component
ZD24C02B-XGMT
Electronic Component
1
Package
TSSOP8
Electronic Component
EEPROM
Electronic Component
0.15g
Electronic Component
1
Electronic Component
BM0264678805
Electronic Component
2Kbit
Operating Temperature
40℃~+125℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
1MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZD24C02B-XGMT 串行EEPROM产品概述

ZD24C02B-XGMT是澜智(Zetta)推出的一款2Kbit串行I2C接口EEPROM,专为小容量非易失存储、宽电压/宽温适应性场景设计,兼具高速传输、长寿命和高可靠性,覆盖工业控制、消费电子、物联网等多领域应用。

一、产品核心定位与功能

作为串行EEPROM的经典容量型号(2Kbit=256字节),ZD24C02B-XGMT的核心作用是掉电后永久保存小量关键数据,例如设备ID、校准参数、用户配置、传感器阈值等。其采用成熟的I2C双向串行接口,仅需两根信号线(SDA/SCL)即可实现数据读写,极大简化硬件设计;同时支持多设备级联(通过地址引脚配置),便于构建分布式存储方案。

二、关键性能参数深度解析

ZD24C02B-XGMT的参数针对实际应用痛点优化,核心参数及价值如下:

1. 存储与接口特性

  • 容量:2Kbit(256字节),满足大多数设备的小容量配置存储需求,无需额外扩展大容量存储,降低成本;
  • 接口:I2C串行接口,兼容主流MCU(STM32、AVR、51系列等)的I2C外设,支持1MHz高速模式(远超普通I2C的100kHz/400kHz),数据传输效率提升5~10倍,适合对存储速度敏感的场景。

2. 电压与温度适应性

  • 工作电压:1.7V~5.5V超宽范围,覆盖3.3V(低功耗MCU)、5V(传统设备)甚至1.7V(电池供电终端),无需电平转换,兼容性极强;
  • 工作温度:-40℃+125℃工业级宽温,可适应户外环境(太阳能传感器)、工业现场(PLC扩展模块)等极端温度场景,可靠性远超商业级(0℃70℃)产品。

3. 可靠性与寿命

  • 数据保留时间:100年(-40℃~+85℃),即使长期存储,关键数据也不会丢失,适合存储设备出厂校准数据等永久信息;
  • 写周期寿命:100万次(典型值),是普通EEPROM(10万次)的10倍,可满足频繁修改用户设置(如智能家电定时参数)的场景;
  • 写周期时间:5ms(典型),写入响应速度快,减少系统等待时间,提升整体效率。

三、封装与物理特性

ZD24C02B-XGMT采用TSSOP-8封装,属于薄型小尺寸封装:

  • 尺寸约4.4mm×3.0mm×1.0mm,相比传统DIP-8封装体积缩小约70%,适合高密度PCB设计(可穿戴设备、小型传感器节点);
  • 引脚布局遵循串行EEPROM标准定义(SDA、SCL、地址引脚A0/A1/A2、写保护WP、VCC、GND),便于直接替换现有24C02系列产品,无需修改硬件电路。

四、典型应用场景

结合产品优势,ZD24C02B-XGMT的主要应用场景包括:

  1. 工业控制:PLC模块、温度/压力传感器节点、电机控制器(存储校准参数);
  2. 消费电子:智能家电(空调/洗衣机定时设置)、可穿戴设备(智能手环用户配置)、蓝牙音箱(配对列表);
  3. 物联网终端:WiFi模块(存储MAC地址/SSID)、低功耗节点(电池供电环境监测器);
  4. 汽车电子周边:车载传感器(胎压监测、倒车雷达)、仪表盘(里程校准数据);
  5. 医疗设备:小型监护仪(患者基础信息)、便携式血糖仪(校准曲线)。

五、产品优势对比

与市场常见24C02系列产品相比,ZD24C02B-XGMT的核心优势:

  • 宽电压:1.7V启动,覆盖更多低功耗场景;
  • 高速:1MHz I2C,传输效率提升显著;
  • 长寿命:100万次写周期,适合频繁写入;
  • 宽温:-40~125℃工业级,适应极端环境;
  • 长保留:100年数据保留,可靠性更高。

ZD24C02B-XGMT凭借高集成度、宽适应性和高可靠性,成为小容量非易失存储场景的高性价比优选方案,可有效降低系统设计复杂度,提升产品稳定性。

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