WMSIC Electronic Components

Zetta ZD1117ILTR331

ModelZD1117ILTR331
PackageSOT223
BrandZETTA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Zetta ZD1117ILTR331
Type
SOT223
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
1.3V@(1A)
Electronic Component
ZETTA
Electronic Component
ZD1117ILTR331
Electronic Component
1
Package
SOT223
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.1g
Electronic Component
1
Electronic Component
BM0264678804
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
16V
Output
Electronic Component
Output Voltage
3.3V
Output Current
1A
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZD1117ILTR331 低压差线性稳压器产品概述

ZD1117ILTR331是澜智(Zetta)推出的固定输出型低压差线性稳压器(LDO),专为需要稳定3.3V电源、且对效率和空间有要求的电子系统设计。其核心参数覆盖宽电压范围、大输出电流及工业级温度适应性,同时集成双保护功能,可满足多种场景的可靠性需求。

一、产品核心定位与关键特性

该芯片的核心定位是中小功率固定3.3V电源转换,重点解决“输入电压 margin 小”“空间紧凑”“宽温环境”下的电源稳定问题。关键特性包括:

  1. 固定输出设计:输出电压严格锁定3.3V,无需外部电阻调整,简化电路设计;
  2. 宽输入电压范围:支持16V最大输入电压,适配多种前级电源(如开关电源输出、电池组等);
  3. 大电流输出能力:持续输出电流可达1A,满足MCU、传感器、小型显示屏等负载的供电需求;
  4. 低压差性能:满载(1A)时压差仅1.3V,即输入电压只需4.6V以上即可稳定输出3.3V,适合电池供电或输入电压波动大的场景;
  5. 双保护机制:集成过热保护(Tj超温时关断,降温后自动恢复)和过流保护(输出电流超限时限流,防止负载/芯片损坏);
  6. 工业级温度范围:结温支持-40℃~+125℃,可适应工业控制、车载辅助系统等高温/低温环境。

二、关键电气参数深度解析

1. 电压与电流参数

  • 输入电压:最大16V,最小需满足“输出电压+压差”(即3.3V+1.3V=4.6V),实际应用中建议输入电压不低于5V以保证稳定性;
  • 输出电压:固定3.3V,精度满足常规系统需求(通常±1%以内,需参考 datasheet 具体规格);
  • 输出电流:持续1A,峰值电流可适当放宽(需结合热设计);
  • 压差特性:压差随负载电流增加而略有上升,但1A满载时仅1.3V,远优于普通线性稳压器(如78xx系列压差通常2V以上)。

2. 静态功耗与效率

静态电流(Iq)为2mA,属于LDO中的中等水平——既保证了输出稳定性,又避免了极端低Iq芯片的输出纹波或响应速度问题。在轻载(如10mA)时,效率约为3.3V/(输入电压),满载时效率约为3.3V/(3.3V+1.3V)=71.7%,适合对效率要求不极端但需要稳定输出的场景。

3. 保护功能细节

  • 过热保护:当芯片结温(Tj)超过150℃左右(具体值参考 datasheet)时,芯片关断输出;温度下降至约120℃时自动恢复,防止长期过热损坏;
  • 过流保护:输出电流超过1.2A~1.5A(典型值)时,芯片进入限流模式,限制输出电流在安全范围内,避免负载短路或过载导致的芯片烧毁。

三、封装与可靠性设计

ZD1117ILTR331采用SOT223封装,是一款小型表面贴装封装(尺寸约6.5mm×3.5mm),具有以下优势:

  1. 空间紧凑:适合PCB空间有限的产品(如便携式设备、小型工业模块);
  2. 散热性能:SOT223封装的热阻约为50℃/W(典型值),结合满载时1.3W的功耗((4.6V-3.3V)×1A),结温上升约65℃——若环境温度为25℃,则结温约90℃,远低于125℃的最大结温,散热可靠性有保障;
  3. 焊接兼容性:支持回流焊、波峰焊等常规SMT工艺,适合批量生产。

四、典型应用场景

该芯片可广泛应用于以下场景:

  1. 工业控制设备:PLC模块、传感器节点、电机驱动辅助电源(需稳定3.3V给MCU供电);
  2. 车载电子:车载显示屏、倒车雷达辅助电源(适应-40℃~+85℃的车载环境温度);
  3. 消费电子:便携式医疗设备、小型智能音箱(满足1A电流需求,空间紧凑);
  4. 通信设备:小型基站、路由器的辅助电源模块(稳定3.3V给射频模块或控制芯片供电)。

五、选型与使用注意事项

  1. 输入电压限制:严禁输入电压超过16V,避免芯片过压损坏;
  2. 输出电容配置:建议在输出端并联10μF以上的陶瓷电容(或电解电容),靠近芯片引脚以降低纹波;
  3. 散热设计:PCB上的输出/地引脚建议增加铜箔面积(如铺1oz铜箔),提升散热能力;
  4. 负载匹配:过流保护阈值为1.2A~1.5A,若负载电流接近该值,需确认散热是否足够;
  5. 温度降额:当环境温度超过85℃时,建议将最大输出电流降至0.8A以下,避免结温过高。

ZD1117ILTR331以“高性价比+稳定可靠”为核心优势,适合对电源稳定性要求较高、但预算有限的中小功率电子系统。其集成的保护功能和宽温范围,可有效降低系统故障率,减少后期维护成本。

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