WMSIC Electronic Components

ZD24C16A-XGMT

ModelZD24C16A-XGMT
PackageTSSOP8
BrandZETTA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Zetta ZD24C16A-XGMT
Type
ZETTA
Minimum package
3000 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ZETTA
Electronic Component
ZD24C16A-XGMT
Electronic Component
1
Package
TSSOP8
Electronic Component
EEPROM
Electronic Component
0.132g
Electronic Component
1
Electronic Component
BM0264678810
Electronic Component
16Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
1MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZD24C16A-XGMT 16Kbit I2C接口EEPROM产品概述

ZD24C16A-XGMT是澜智(Zetta)推出的一款16Kbit容量串行EEPROM,专为需要稳定存储小容量配置数据的场景设计,核心采用I2C串行接口,兼具宽电压适配、高可靠性与紧凑封装等特点,可覆盖物联网、工业控制、车载电子等多领域应用需求。

一、产品核心定位与优势

作为面向中小容量存储需求的EEPROM,ZD24C16A-XGMT的核心优势体现在全场景适配性与高可靠性:

  • 宽电压范围(1.7V~5.5V)兼容低功耗物联网设备到传统5V工业电路,无需额外电压转换;
  • 1MHz高速I2C时钟支持快速数据读写,提升系统响应效率;
  • 工业级可靠性(100万次写周期、100年数据保留)满足长期频繁写入需求;
  • TSSOP-8紧凑封装节省PCB空间,适配小型化产品设计。

二、关键技术参数详解

1. 存储与接口性能

  • 存储容量:16Kbit(换算为2048字节),支持字节/页写入,页大小符合I2C EEPROM通用规范,可存储设备配置、校准数据、ID信息等;
  • I2C接口:支持标准/快速模式,最大时钟频率1MHz,数据传输速率相比低速I2C提升3倍,适合对读写速度有要求的场景;
  • 写周期时间:仅3ms,比多数同类产品快40%以上,可快速完成参数更新(如传感器校准、模式切换)。

2. 电源与环境适应性

  • 工作电压:1.7V~5.5V,覆盖1.8V低功耗MCU(如物联网终端)、3.3V主流系统及5V工业电路,简化系统电源设计;
  • 工作温度:-40℃~+85℃(工业级),可在户外低温(如北方冬季监测)、高温工业场景(如电机控制柜)稳定工作,无数据丢失风险。

三、封装与可靠性保障

1. 紧凑封装设计

采用TSSOP-8封装,引脚间距0.65mm,体积仅为传统DIP-8的1/3左右,适合智能穿戴、微型传感器、小型工业模块等对PCB空间要求严格的产品;同时TSSOP封装焊接可靠性高,适配批量自动化生产。

2. 长期可靠性验证

  • 写周期寿命:100万次(是普通EEPROM的10倍),可满足设备每日多次校准、参数调整的频繁写入需求;
  • 数据保留时间:100年,无电源状态下存储的关键数据(如设备ID、校准曲线)可长期保持,确保产品5年以上使用后的一致性。

四、典型应用场景

ZD24C16A-XGMT的多特性适配性使其在多领域广泛应用:

  1. 物联网终端:环境监测传感器(存储校准值)、智能门锁(存储用户配置)、低功耗穿戴设备(存储运动模式参数);
  2. 工业控制:PLC临时配置存储、电机驱动模块(存储控制参数)、工业传感器节点(存储温度校准数据);
  3. 车载电子:仪表盘个性化设置(如座椅记忆)、胎压监测传感器(存储校准值)、车载CAN总线节点(存储ID配置);
  4. 消费电子:遥控器(存储设备配对信息)、智能音箱(存储网络配置)、小型医疗设备(存储患者基础数据)。

五、总结

ZD24C16A-XGMT作为澜智推出的16Kbit I2C EEPROM,以宽电压适配、高速读写、工业级可靠性与紧凑封装为核心亮点,解决了中小容量存储场景下的“适配性不足、可靠性不够、空间受限”等痛点,是物联网、工业控制、车载电子等领域的高性价比存储器件选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.