WMSIC Electronic Components

ZD25LD40BEIGR

ModelZD25LD40BEIGR
PackageUSON-8(2x3)
BrandZETTA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Zetta ZD25LD40BEIGR
Type
ZETTA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ZETTA
Electronic Component
ZD25LD40BEIGR
Electronic Component
1
Package
USON-8(2x3)
Electronic Component
NOR FLASH
Electronic Component
0.046g
Electronic Component
1
Features
positions
Electronic Component
BM0264678798
Electronic Component
4Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.65V~2V
Current
9uA
Interface Type
SPI
Electronic Component
100000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZD25LD40BEIGR 产品概述

一、产品简介

ZD25LD40BEIGR 是澜智(Zetta)推出的一款低压 SPI NOR Flash 存储器,容量 4 Mbit(512 KByte),工作电压范围 1.65 V 至 2.0 V,支持高达 85 MHz 的 SPI 时钟,封装为小型 USON-8 (2×3)。器件针对功耗敏感与空间受限的终端应用进行了优化,适合电池供电、便携和工业级场景。

二、主要电气与时序参数

  • 存储容量:4 Mbit(512 KByte)
  • 最高 SPI 时钟频率 (fc):85 MHz
  • 工作电压:1.65 V ~ 2.0 V
  • 待机电流:9 μA(典型)
  • 擦写寿命:100,000 次(典型)
  • 写周期时间 (Tw):8 ms
  • 页写入时间 (Tpp):1.6 ms
  • 块擦除时间 (tBE):10 ms
  • 数据保留 (TDR):20 年
  • 工作温度:-40 ℃ ~ +85 ℃

三、功能特性与数据保护

器件支持多层写保护机制,包括硬件写保护、绝对写保护、写使能锁存(WEL)和软件写保护,同时内置上电复位功能,确保上电瞬态期间的数据与总线安全。此类保护组合便于在系统软件与硬件层面同时实施防误写及防篡改策略。

四、封装与可靠性

USON-8 (2×3) 小体积封装适合高密度系统板设计,减小 PCB 占用。器件经过高擦写寿命与长期数据保持(20 年)设计,适合对可靠性要求高的工业、物联网与消费类设备。

五、典型应用场景

  • 物联网终端与传感器节点(低功耗、低压工作)
  • 可穿戴设备与便携式终端(小封装、低待机)
  • 工业控制与通信设备(宽温度范围、长期可靠)
  • 固件存储、参数配置与引导代码(Boot ROM 扩展)

六、系统设计建议

  • 供电与接口电平:主控器需支持 1.65–2.0 V 电平或使用双向电平移位器以兼容 3.3 V/5 V 主机。
  • 去耦与电源完整性:在 VCC 近旁放置 0.1 μF 陶瓷去耦,靠近器件放置,减少供电噪声。
  • SPI 布局与信号完整性:尽量缩短 SCLK/MOSI/MISO/CS 路径,必要时在输出线上加小阻尼电阻以抑制环回。
  • 写保护策略:建议在系统中结合硬件 WP 与软件保护,以防止误写操作;在固件更新流程中明确写使能/擦除的时序控制。
  • 热管理与可靠性:在高频操作或密集擦写情况下注意总体热量释放,维持器件在推荐工作温度范围内。

ZD25LD40BEIGR 以其低压、低功耗、小封装和完备的写保护功能,为需要可靠非易失性存储且受功耗与空间约束的应用提供了稳定且易于集成的解决方案。如需引脚分配、命令集或电气时序图,请参考澜智的详细数据手册以获得完整规范与典型应用电路。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.