WMSIC Electronic Components

ZD25Q128CSIGT

ModelZD25Q128CSIGT
PackageSOP-8-208mil
BrandZETTA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Zetta ZD25Q128CSIGT
Type
ZETTA
Minimum package
9600 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ZETTA
Electronic Component
ZD25Q128CSIGT
Electronic Component
1
Package
SOP-8-208mil
Electronic Component
NOR FLASH
Electronic Component
0.248g
Electronic Component
1
Features
positions
Electronic Component
BM0264500220
Electronic Component
128Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
15uA
Interface Type
SPI
Electronic Component
100000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZD25Q128CSIGT SPI Flash 产品概述

ZD25Q128CSIGT是澜智(Zetta)推出的一款工业级高速SPI Flash存储芯片,主打高容量、高速传输、低功耗三大核心优势,适配工业控制、消费电子、智能家居等多场景的固件存储与数据记录需求,其关键参数覆盖主流应用场景的性能与可靠性要求。

一、产品定位与核心特性

ZD25Q128CSIGT定位于通用型SPI Flash,核心特性聚焦“速度+可靠+低耗”:

  • 容量端:128Mbit(16MB)存储容量,可满足固件、配置数据、日志等多类型数据的存储需求;
  • 速度端:最高支持133MHz SPI时钟频率,保障数据读写的高速性;
  • 可靠端:10万次擦写寿命、20年数据保留时间,适配频繁擦写的工业场景;
  • 功耗端:15uA典型待机电流,降低电池供电设备的静态功耗;
  • 环境端:-40℃~+85℃工业级工作温度范围,适应极端环境应用。

二、关键参数详解

ZD25Q128CSIGT的关键参数覆盖性能、功耗、可靠性三大维度,具体如下:

  1. 容量与接口:存储容量128Mbit(即16MB),采用标准SPI接口(兼容SPI 1.0/2.0协议),可与主流MCU(如STM32、ATmega系列)直接对接,无需额外接口转换;
  2. 速度性能:最高时钟频率达133MHz,在SPI模式下可实现最高133Mbps的数据传输速率,满足固件快速升级、大数据块读写需求;
  3. 功耗表现:工作电压范围2.7V~3.6V,覆盖3.3V主流系统电压;典型待机电流仅15uA,休眠模式下功耗进一步降低,适合电池供电的便携设备或低功耗工业节点;
  4. 可靠性指标:擦写寿命达10万次(远高于普通Flash的1万次标准),可支持频繁固件更新与数据擦写;数据保留时间20年,在常温下可长期稳定存储数据;工作温度范围-40℃~+85℃,满足工业现场(如户外传感器、车间控制器)的温湿度要求;
  5. 写入性能:页写入时间(Tpp)仅500us,单页写入完成时间短,可提升批量数据写入效率。

三、封装与集成性

ZD25Q128CSIGT采用SOP-8-208mil封装,属于小型贴片封装:

  • 引脚布局与常见SPI Flash(如W25Q128)兼容,可直接替换或复用现有PCB设计,降低开发成本;
  • 208mil封装尺寸紧凑,适合高密度PCB布局(如小型化消费电子、紧凑型工业模块);
  • 贴片式封装便于自动化焊接,提升生产效率,同时降低虚焊、漏焊风险。

四、典型应用场景

ZD25Q128CSIGT的参数特性使其适配多领域应用:

  1. 工业控制领域:PLC的固件存储、传感器节点的数据日志记录(宽温+低功耗);
  2. 消费电子领域:机顶盒、路由器、智能电视的固件升级、配置数据存储(高速+大容量);
  3. 智能家居领域:智能网关、智能门锁的程序存储(低功耗+稳定可靠);
  4. 便携设备领域:手持终端、可穿戴设备的辅助存储(小封装+低待机电流);
  5. 医疗设备领域:小型医疗仪器的固件与患者数据存储(高可靠+长数据保留)。

五、产品优势总结

ZD25Q128CSIGT相比同类产品,核心优势体现在:

  • 平衡型性能:133MHz高速+16MB容量,兼顾速度与存储需求;
  • 工业级可靠:-40~85℃温区、10万次擦写、20年保留,适配严苛场景;
  • 低耗易集成:15uA待机电流、兼容SOP-8封装,降低系统功耗与开发难度;
  • 成本可控:主流封装+成熟工艺,性价比高于同规格工业级Flash。

整体来看,ZD25Q128CSIGT是一款“性能够用、可靠够强、集成够易”的SPI Flash,适合对速度、功耗、可靠性有均衡要求的终端产品设计。

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