Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ZDND2G8U3D-IA采用NAND Flash架构,核心存储容量为2Gbit(换算为256MB字节级容量),可覆盖多数中低容量存储需求场景。性能参数上,页写入时间(Tpp)仅300us,单页数据写入效率较高,适合需要快速更新日志、配置文件的设备;块擦除时间(tBE)为2ms,相比部分同容量竞品,擦除速度处于主流偏上水平,可减少批量数据更新时的等待时间。
容量方面,256MB字节容量可满足工业控制设备的固件存储、物联网终端的传感器数据缓存、车载电子的小容量日志记录等需求,无需额外扩展存储,降低系统硬件成本。
该芯片的环境适应性与可靠性突出,具体表现为:
ZDND2G8U3D-IA采用TSOP-48-12.0mm封装:TSOP(薄型小外形封装)是成熟的表面贴装形式,48引脚设计提供充足I/O接口,12.0mm宽度兼顾散热与PCB布局密度,适合高密度PCB设计的设备。
典型应用场景包括:
该芯片由澜智(Zetta)出品,澜智专注存储芯片研发生产,产品覆盖工业级、消费级领域,以可靠性与稳定性著称。
ZDND2G8U3D-IA的核心优势:
综上,ZDND2G8U3D-IA是一款适配工业级与主流消费电子场景的高可靠性存储芯片,参数均衡且环境适应性强,适合对存储容量、速度与稳定性有综合要求的设备设计。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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