WMSIC Electronic Components

SCTF SX3B12.000F1210F30

ModelSX3B12.000F1210F30
PackageSMD3225-4P
BrandSCTF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SCTF SX3B12.000F1210F30
Type
SCTF
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SCTF
Electronic Component
SX3B12.000F1210F30
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.046g
Frequency
12MHz
Electronic Component
1
Electronic Component
BM0266061162
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±30ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SX3B12.000F1210F30 无源贴片晶振产品概述

SX3B12.000F1210F30是星通时频(SCTF) 推出的通用型无源贴片晶振,采用SMD3225-4P小型化封装,核心频率12MHz,针对消费电子、工业控制、通信等多场景的稳定时钟需求设计,兼具精度、可靠性与适配性。

一、产品定位与核心属性

该产品属于无源晶振范畴(无内置驱动电路,依赖外部振荡电路谐振),核心定位为中小尺寸、工业级温度范围的通用时钟基准。相比有源晶振,无源设计成本更低、可靠性更高;相比大尺寸晶振,SMD3225封装更适配便携设备小型化趋势,可替代同规格进口晶振,满足从消费电子到工业现场的多样化需求。

二、关键性能参数的实际价值

1. 频率精度与温度稳定性

  • 常温频差±10ppm:在25℃环境下,频率偏差不超过12MHz×10ppm=120Hz,可满足多数数字电路(如STM32系列MCU、FPGA)的时钟精度要求(主流MCU允许的时钟偏差通常在±50ppm以内);
  • 全温频率稳定度±30ppm:覆盖-40℃~+85℃工作温度范围,频率偏差≤360Hz。即使在低温(如北方户外传感器节点)或高温(如密闭工业机箱)场景下,仍能避免时钟漂移导致的系统故障(如BLE通信丢包、ADC采样误差)。

2. 负载电容与振荡匹配

负载电容为12pF,是无源晶振振荡电路的关键设计参数。该值为行业通用标准,需与外围两个匹配电容(通常为12pF左右)配合,抵消电路寄生电容后实现谐振。无需额外复杂调试,可直接适配多数主流芯片的内置振荡单元,缩短产品研发周期。

3. 等效串联电阻(ESR)

ESR控制在100Ω以内,处于无源晶振的合理区间:

  • 既保证了振荡电路的启动可靠性(ESR越低,启动裕量越大);
  • 又避免了过高功耗(ESR过大将增加电路损耗),适合对功耗敏感的便携设备(如智能手环、蓝牙耳机)。

三、封装与安装适配性

采用SMD3225-4P封装(尺寸3.2mm×2.5mm),4引脚贴片设计:

  • 适配自动化SMT贴装,生产效率高,适合大规模量产;
  • 小尺寸节省PCB空间,符合现代电子设备小型化趋势(如智能穿戴、微型工业控制器);
  • 引脚间距与焊盘设计兼容多数PCB设计规范,无需特殊布线要求,降低电路设计难度。

四、环境适应性与可靠性

  1. 宽温工作能力:-40℃~+85℃覆盖工业级基本温度范围,可用于户外物联网节点、车载信息娱乐系统(部分低温场景)、工业PLC等;
  2. 无源设计优势:无内置驱动电路,避免了有源晶振的驱动芯片故障风险,可靠性更高,寿命可达5~10年;
  3. 环保合规:符合RoHS无铅标准,满足全球市场的环保要求,可直接用于出口产品。

五、典型应用领域

该晶振因参数均衡、适配性强,广泛应用于以下场景:

  • 消费电子:智能手环/手表的MCU时钟、蓝牙耳机的BLE射频基准、小型投影仪的时序控制;
  • 工业控制:PLC的时钟同步、工业传感器节点的通信时钟、电机控制器的采样基准;
  • 通信设备:低功耗蓝牙(BLE)模块、WiFi模块、LoRa网关的参考频率;
  • 安防监控:网络摄像头的视频同步时钟、门禁系统的控制时钟;
  • 汽车电子(辅助场景):车载USB接口控制器、胎压监测传感器的辅助时钟。

六、品牌与品质保障

星通时频(SCTF)是国内专业频率器件制造商,拥有多年晶振研发生产经验,产品通过ISO9001质量体系认证,批量供货稳定,可提供样品测试与技术支持(如振荡电路匹配建议),适合中小批量到大规模生产需求。

整体来看,SX3B12.000F1210F30以“高精度、宽温适配、小尺寸、高性价比”为核心优势,是替代进口同规格晶振的可靠选择,可满足多领域电子设备的稳定时钟需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.