Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SX5A8.000F1210F30是星通时频(SCTF) 推出的通用型无源贴片晶振,采用SMD5032-2P封装,以8MHz为核心频率,兼顾精度、稳定性与成本优势,适配消费电子、工业控制、物联网等多领域的时钟信号需求。
该晶振由国内专业时频器件厂商SCTF研发生产,属于通用高性能无源晶振,主打“小体积、宽温稳定、易集成”特性,适合中低端到中端电子设备的时钟基准需求。
型号SX5A8.000F1210F30可清晰对应核心参数:
采用SMD5032-2P封装,尺寸为5.0mm×3.2mm×1.2mm(典型),2引脚贴片式设计,支持自动化SMT贴装,可直接集成到高密度PCB板中,节省布局空间。
负载电容为12pF,是无源晶振与外部振荡电路匹配的关键。设计时需将外部匹配电容(通常2个12pF并联)调整至该值,可保证晶振快速起振且稳定工作,避免匹配不当导致停振。
ESR为100Ω,属于同类产品较低水平。低ESR可降低晶振功耗,提升起振灵敏度——即使电源电压波动或负载变化,仍能保持稳定振荡,减少调试难度。
覆盖**-40℃~+85℃**,满足工业级(户外传感器、车载周边)和消费级(智能穿戴、智能家居)场景的温度需求,无需额外散热设计。
SX5A8.000F1210F30的参数特性适配多类设备:
SX5A8.000F1210F30是一款均衡型无源贴片晶振,以8MHz核心频率为基础,兼顾精度、稳定性与成本,适配多场景需求。其SMD5032封装易集成,宽温范围可靠,是中小批量电子设备时钟基准的优选方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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