WMSIC Electronic Components

SCTF SX1M8.000M10F30TNN

ModelSX1M8.000M10F30TNN
PackageSMD2016-4P
BrandSCTF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SCTF SX1M8.000M10F30TNN
Type
SMD2016-4P
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SCTF
Electronic Component
SX1M8.000M10F30TNN
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.055g
Frequency
8MHz
Electronic Component
1
Electronic Component
BM0266061191
Operating Temperature
40℃~+85℃
Operating Voltage
1.62V~3.63V
Operating Current
10mA
Electronic Component
±10ppm
Output
CMOS
Frequency
±30ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SX1M8.000M10F30TNN 有源晶振产品概述

一、产品核心定位与典型应用场景

SX1M8.000M10F30TNN是SCTF(星通时频) 推出的工业级CMOS有源晶振,主打「小型化、宽电压适配、稳定频率输出」三大核心特性,定位为中高精度时钟源,可覆盖多领域场景:

  • 工业自动化:PLC控制器、传感器模块、工业通信网关的时钟同步电路;
  • 物联网终端:低功耗智能设备、无线传感节点(适配1.8V~3.3V电池供电);
  • 消费电子:智能穿戴、小型家电、便携式医疗设备的核心时钟;
  • 汽车电子:车载信息娱乐系统、胎压监测模块(满足-40℃~+85℃宽温要求)。

该产品无需外接匹配电容,简化电路设计的同时减少PCB面积,适合对空间敏感的小型化设备。

二、关键性能参数深度解析

产品参数围绕「频率精度、电压适配、环境稳定性」三大维度设计,具体解析如下:

  • 频率精度:标称频率8MHz,常温(25℃)频差±10ppm(实际偏差≤80Hz),全温范围(-40℃~+85℃)稳定度±30ppm(偏差≤240Hz),满足工业控制、数据传输的时钟同步需求;
  • 输出与供电:CMOS输出模式,电平与供电电压兼容(3.3V供电时,高电平≈Vcc、低电平≈0V),无需电平转换即可匹配STM32、ESP32等主流MCU;工作电压1.62V~3.63V,覆盖1.8V、3.3V常见规格,适配电池与稳压电源;
  • 功耗特性:典型工作电流10mA,兼顾输出稳定性与功耗平衡,适合对功耗要求不极端但需稳定时钟的场景。

三、封装与机械特性

采用SMD2016-4P 贴片封装,尺寸为2.0mm×1.6mm×0.8mm(长×宽×高),4引脚布局符合行业标准:

  • 引脚1:Vcc(供电);
  • 引脚2:GND(地);
  • 引脚3:OUT(时钟输出);
  • 引脚4:NC(空脚,部分型号无定义)。

小尺寸封装可直接集成于高密度PCB,焊接工艺兼容回流焊、波峰焊,生产兼容性良好。

四、环境适应性与可靠性

SCTF针对工业级应用优化了产品可靠性:

  • 宽温工作:-40℃~+85℃覆盖绝大多数工业现场、户外设备与车载环境,无需额外散热;
  • 抗干扰性:内置振荡电路,相比无源晶振抗电磁干扰能力更强,避免工业噪声影响时钟精度;
  • 环保与品质:通过RoHS认证,符合环保要求;SCTF作为国内主流厂商,批量供货稳定性高,满足量产需求。

五、选型对比与应用优势

对比同规格无源晶振,SX1M8.000M10F30TNN具备明显优势:

  1. 简化电路:无需外接负载电容,减少元件数量与PCB面积;
  2. 更高稳定性:内置振荡电路,受温度、电压波动影响更小;
  3. 宽电压适配:1.62V~3.63V覆盖更多供电场景(无源晶振通常需固定3.3V/5V)。

适合替代无源晶振的场景:频率精度要求>±50ppm、空间受限、电压范围宽的设计。

该产品以高性价比、稳定可靠的特性,成为工业与消费电子领域时钟电路的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.