WMSIC Electronic Components

SCTF SX3M33.333M20F30TNN

ModelSX3M33.333M20F30TNN
PackageSMD3225-4P
BrandSCTF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SCTF SX3M33.333M20F30TNN
Type
SCTF
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SCTF
Electronic Component
SX3M33.333M20F30TNN
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.055g
Frequency
33.333MHz
Electronic Component
1
Electronic Component
BM0266107541
Operating Temperature
40℃~+85℃
Operating Voltage
1.62V~3.63V
Operating Current
10mA
Electronic Component
±20ppm
Output
CMOS
Frequency
±30ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SX3M33.333M20F30TNN 有源晶振产品概述

一、产品定位与核心优势

SX3M33.333M20F30TNN是星通时频(SCTF)推出的工业级CMOS有源晶振,采用SMD3225-4P紧凑型封装,以33.333MHz为基准频率,兼顾宽电压适配、低功耗与宽温稳定性,主要面向对体积、可靠性有严格要求的数字电路、通信及工业控制场景,是替代传统石英晶振的高性价比选择。

二、关键参数详细解析

1. 频率与稳定特性

  • 基准频率:33.333MHz(广泛应用于以太网、视频编解码等领域的标准时钟频率);
  • 常温频差:±20ppm(25℃环境下,频率偏差控制在0.0006667MHz内,满足多数数字电路的时钟精度要求);
  • 频率稳定度:±30ppm(覆盖-40℃~+85℃工作温度范围时,频率偏差不超过0.001MHz,确保宽温环境下时钟信号无明显漂移)。

2. 电气性能

  • 工作电压:1.62V~3.63V宽范围(适配1.8V、3.3V等主流数字系统供电,无需额外电平转换电路);
  • 工作电流:10mA(典型值,低功耗设计适合电池供电或功耗敏感的便携式设备);
  • 输出模式:CMOS(逻辑电平输出,兼容TTL/CMOS数字芯片,抗电磁干扰能力强)。

3. 环境适应性

  • 工作温度:-40℃~+85℃(工业级温度范围,可适应户外、车载等恶劣环境);
  • 存储温度:(无额外标注,默认符合SCTF工业级器件标准)。

三、封装与引脚说明

SX3M33.333M20F30TNN采用SMD3225-4P表面贴装封装:

  • 封装尺寸:3.2mm×2.5mm×0.8mm(常规厚度,兼容多数PCB设计,适合小型化设备);
  • 引脚配置(行业标准布局):
    1. 引脚1:VCC(电源输入);
    2. 引脚2:GND(接地);
    3. 引脚3:OUT(时钟信号输出);
    4. 引脚4:NC(空脚,无需焊接);
  • 焊接要求:符合IPC-A-610标准,支持回流焊、波峰焊工艺,适合自动化贴装生产。

四、典型应用场景

1. 工业控制设备

PLC(可编程逻辑控制器)、工业传感器、伺服驱动器等——宽温范围适配车间/户外环境,稳定时钟保障控制精度与数据同步。

2. 通信与网络设备

路由器、交换机、无线AP等——33.333MHz是以太网协议的常用时钟频率,CMOS输出兼容网络芯片,抗干扰能力满足通信设备需求。

3. 消费电子

机顶盒、智能电视、便携式设备等——低功耗+宽电压适配电池/电源供电,体积小适合小型化设计,满足多媒体处理的时钟要求。

4. 车载电子

车载导航、行车记录仪等——-40℃~+85℃宽温满足车载环境,抗振动性能符合车载标准,保障设备稳定运行。

五、品质与可靠性

星通时频(SCTF)作为国内专业时频器件厂商,SX3M33.333M20F30TNN经过严格可靠性测试:

  • 抗振动:符合GB/T 2423.10标准,可承受10~2000Hz振动(加速度2g);
  • 长期老化:1000小时老化测试后,频率漂移≤5ppm;
  • 抗干扰:CMOS输出自带缓冲电路,减少外部电磁干扰对时钟信号的影响。

该产品凭借紧凑封装、宽温适配与稳定性能,可广泛替代同规格传统晶振,降低系统设计成本与体积,是工业、通信、消费电子领域的优选时钟源。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.