WMSIC Electronic Components

SCTF SX2M24.000M20F30TNN

ModelSX2M24.000M20F30TNN
PackageSMD2520-4P
BrandSCTF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SCTF SX2M24.000M20F30TNN
Type
SCTF
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SCTF
Electronic Component
SX2M24.000M20F30TNN
Electronic Component
1
Package
SMD2520-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.036g
Frequency
24MHz
Electronic Component
1
Electronic Component
BM0266061176
Operating Temperature
40℃~+85℃
Operating Voltage
1.62V~3.63V
Operating Current
10mA
Electronic Component
±20ppm
Output
CMOS
Frequency
±30ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SX2M24.000M20F30TNN有源晶振产品概述

SX2M24.000M20F30TNN是SCTF星通时频推出的一款工业级CMOS输出有源晶体振荡器,专为需要稳定时钟基准的数字系统设计,兼顾宽温适应性、小体积与高兼容性,适用于工业控制、物联网、车载电子等多领域场景。

一、产品定位与核心属性

该产品属于高频有源晶振,标称频率24MHz,采用CMOS数字输出模式,可直接匹配MCU、FPGA、通信芯片等主流数字器件的IO接口,无需额外电平转换电路,简化系统设计。其工业级宽温范围、宽电压适配性,使其在复杂应用环境下仍能保持可靠的时钟输出性能。

二、关键性能参数详解

1. 频率与精度

  • 标称频率:24MHz,为多数数字系统(如微控制器、无线模块)的常用时钟基准频率,兼容性强;
  • 常温频差:±20ppm(25℃环境下),即频率偏差控制在24MHz×20ppm=480Hz以内,满足一般消费电子与工业设备的精度需求;
  • 频率稳定度:±30ppm(-40℃~+85℃温度范围内),体现了宽温下的频率稳定性,是工业级产品的核心指标之一,可避免因温度变化导致的时钟漂移。

2. 电气特性

  • 工作电压:1.62V~3.63V,覆盖低功耗1.8V、标准3.3V等常见电源规格,适配便携式设备(如智能穿戴)与工业电源系统;
  • 工作电流:10mA,在有源晶振中属于平衡功耗水平,兼顾输出稳定性与低功耗需求,适合电池供电或对功耗敏感的场景。

3. 环境适应性

  • 工作温度:-40℃~+85℃,符合工业级温度要求,可适应户外、车载、工业车间等极端温度环境;
  • 存储温度:行业常规为-55℃~+125℃,确保运输与存储过程中的可靠性。

三、封装与物理特性

采用SMD2520-4P表面贴装封装,尺寸约为2.5mm×2.0mm×0.8mm(长×宽×高),4引脚设计,体积小巧,可节省PCB布局空间,适合小型化产品(如物联网节点、智能传感器模块)的高密度集成需求。引脚布局符合行业标准,便于焊接与后期调试。

四、品牌与可靠性保障

SCTF(星通时频)是国内专注于时频器件研发与生产的专业厂商,其产品经过严格的可靠性测试:

  • 高低温循环测试(-40℃~+85℃循环);
  • 振动与冲击测试(符合IEC 60068标准);
  • 老化测试(长期通电老化,确保初始性能稳定);
  • 湿度测试(60℃/95%RH环境下工作稳定性)。

这些测试确保产品在实际应用中具有低故障率、长寿命的特点,可降低终端设备的维护成本。

五、典型应用场景

SX2M24.000M20F30TNN的性能特点使其适用于以下场景:

  1. 工业控制领域:PLC可编程逻辑控制器、工业传感器模块、伺服控制系统等,宽温范围与稳定度满足工业环境需求;
  2. 物联网设备:智能网关、无线传感器节点、智能家居终端等,小体积与低功耗适配节点设备;
  3. 车载电子:车载信息娱乐系统、ADAS辅助驾驶模块、车载通信模块等,-40℃~+85℃温度范围适配车载环境;
  4. 消费电子:智能穿戴设备(手表、手环)、便携式医疗设备等,宽电压与小体积提升产品竞争力;
  5. 通信设备:小型基站、无线AP、蓝牙/WiFi模块等,24MHz频率为常用通信时钟基准。

六、选型优势总结

与同类产品相比,SX2M24.000M20F30TNN具有以下优势:

  1. 宽电压适配:1.62V~3.63V覆盖多数电源设计,无需额外电源转换;
  2. 工业级宽温:-40℃~+85℃适应极端环境,避免温度导致的时钟异常;
  3. 高兼容性CMOS输出:直接匹配数字芯片IO,简化电路设计;
  4. 小体积封装:SMD2520-4P节省PCB空间,适合小型化产品;
  5. 可靠品牌保障:SCTF的专业测试与生产工艺,确保产品一致性与稳定性。

该产品可作为多数数字系统的稳定时钟基准,为终端设备提供可靠的时序保障。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.