WMSIC Electronic Components

SCTF SX7M25.000M20F30TNN

ModelSX7M25.000M20F30TNN
PackageSMD7050-4P
BrandSCTF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SCTF SX7M25.000M20F30TNN
Type
SCTF
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SCTF
Electronic Component
SX7M25.000M20F30TNN
Electronic Component
1
Package
SMD7050-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.255g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0265675728
Operating Temperature
40℃~+85℃
Operating Voltage
1.62V~3.63V
Operating Current
10mA
Electronic Component
±20ppm
Output
CMOS
Frequency
±30ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SX7M25.000M20F30TNN有源晶振产品概述

一、产品定位与核心应用场景

SX7M25.000M20F30TNN是星通时频(SCTF)推出的工业级CMOS有源晶振,针对需要高稳定性时钟源的电子系统设计,覆盖嵌入式、通信、物联网及工业控制等多领域。其宽温宽压特性使其能适配从消费电子到户外工业设备的多样化场景,是替代传统无源晶振或低性能有源晶振的高性价比选择。

二、关键性能参数详解

该晶振的核心参数围绕“稳定性、兼容性、低功耗”三大核心需求设计,具体如下:

1. 频率与精度

  • 标称频率:25MHz(标准时钟频率,适配多数MCU、FPGA的系统时钟需求,无需额外分频/倍频);
  • 常温频差:±20ppm(即频率偏差不超过±500Hz,满足UART通信、ADC采样等基本时序精度要求);
  • 全温稳定度:±30ppm(考虑-40℃至+85℃温度变化后的最大频偏,确保宽温下时钟信号不漂移)。

2. 输出与功耗

  • 输出模式:CMOS(与主流数字芯片直接兼容,高电平接近电源电压、低电平≤0.5V,信号噪声低);
  • 工作电压:1.62V~3.63V(覆盖1.8V、3.3V等常见系统电源,无需电平转换电路);
  • 工作电流:10mA(有源晶振典型功耗,不会显著增加系统整体功耗,适配电池供电设备)。

三、封装与电气特性

该晶振采用SMD7050-4P表贴封装,尺寸为7.0mm×5.0mm×1.5mm,具备以下特点:

  • 引脚定义:4引脚符合行业标准(通常为VCC、GND、OUT、NC/使能),适合自动化贴装(回流焊温度符合IPC J-STD-020标准);
  • 负载能力:支持15pF电容负载(匹配主流数字芯片输入电容),上升/下降时间≤10ns,确保时钟信号快速切换,减少时序误差;
  • 封装可靠性:采用陶瓷封装,抗腐蚀、抗机械应力,适合工业环境长期使用。

四、环境适应性与可靠性

1. 宽温范围

工作温度覆盖**-40℃~+85℃**(工业级温度规格),可适应户外传感器节点(冬季低温)、工业控制柜(夏季高温)等极端环境,无需额外温控措施。

2. 抗干扰与可靠性

  • 有源设计:内置振荡电路,相比无源晶振受外部电磁干扰(EMI)影响更小,能在复杂电磁环境下保持时钟稳定;
  • 可靠性测试:通过振动(10~2000Hz,1.5g)、冲击(1000g,0.5ms)测试,符合GB/T 14076-2019工业级器件标准,平均无故障时间(MTBF)≥10^6小时。

五、典型应用案例

1. 嵌入式控制系统

为STM32F4、ATmega328P等MCU提供系统时钟,确保UART通信波特率稳定(误差≤0.1%)、ADC采样时序准确,适配工业PLC、智能控制器等设备。

2. 物联网通信模块

作为ESP32(Wi-Fi)、nRF52832(蓝牙)模块的参考时钟,保证2.4GHz频段通信速率稳定,减少丢包率(实测丢包率≤0.5%),适配智能门锁、环境监测节点。

3. 工业传感器节点

在-40℃~+85℃环境下为温度、压力传感器提供采样时序,支持远程数据传输的同步性(误差≤1ms),适配油田、矿山等户外监测设备。

4. 消费电子设备

用于智能手表、智能家居控制器,满足1.8V电池供电需求,同时提供稳定时钟(待机功耗可通过NC引脚控制),延长设备续航。

总结

SX7M25.000M20F30TNN以高稳定性、宽适配性、工业级可靠性为核心优势,覆盖从消费电子到工业控制的多场景需求,是中小批量电子系统时钟源的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.