WMSIC Electronic Components

SCTF SX1M25.000M10F30TNN

ModelSX1M25.000M10F30TNN
PackageSMD2016-4P
BrandSCTF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SCTF SX1M25.000M10F30TNN
Type
SCTF
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SCTF
Electronic Component
SX1M25.000M10F30TNN
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Active Crystal Oscillator
Electronic Component
0.005g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0266107547
Operating Temperature
40℃~+85℃
Operating Voltage
1.62V~3.63V
Operating Current
10mA
Electronic Component
±10ppm
Output
CMOS
Frequency
±30ppm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SX1M25.000M10F30TNN 有源晶振产品概述

一、产品定位与核心类别

SX1M25.000M10F30TNN是星通时频(SCTF) 推出的工业级CMOS输出有源晶振,针对数字电路时钟同步需求设计,兼具宽电压适配、宽温区稳定、小型化封装等特点,适用于对时钟精度和环境适应性有要求的嵌入式、工业控制及物联网场景。

二、关键参数全面梳理

该型号有源晶振的核心参数可满足多数数字系统的时钟设计需求,具体如下:

  • 频率基准:25MHz(固定输出,无可编程选项)
  • 输出模式:CMOS逻辑电平(与TTL/CMOS数字电路兼容,无需电平转换)
  • 供电范围:1.62V~3.63V(覆盖1.8V、3.3V等主流MCU供电电压)
  • 工作电流:10mA(典型值,宽电压范围内保持稳定)
  • 常温频差:±10ppm(25℃环境下的频率偏差,满足基础精度要求)
  • 全温区稳定度:±30ppm(覆盖-40℃~+85℃的频率偏移控制)
  • 工作温度:-40℃~+85℃(工业级温区,适应复杂环境)
  • 封装规格:SMD2016-4P(贴片封装,尺寸2.0mm×1.6mm,4引脚布局)

三、核心性能优势解析

  1. 宽电压适配性
    1.62V~3.63V供电范围覆盖了从低功耗1.8V系统到3.3V主流MCU的所有常见场景,无需额外设计电平转换电路,可直接与STM32、ATmega等嵌入式芯片对接,简化硬件布局。

  2. 宽温区稳定输出
    工业级-40℃~+85℃温区设计,结合±30ppm全温区稳定度,确保极端温度下(如北方户外设备、高温车间控制器)仍保持时钟精度,避免温度变化导致的系统同步误差。

  3. CMOS输出兼容性
    采用CMOS逻辑电平输出(高电平接近供电电压,低电平接近0V),与TTL/CMOS数字电路完全兼容,输出驱动能力可直接带动多路逻辑门,无需额外缓冲器,降低系统成本。

  4. 小型化封装设计
    SMD2016-4P封装尺寸仅2.0mm×1.6mm,适合小型化产品(如可穿戴设备、物联网终端),4引脚布局符合常规贴片工艺,便于自动化生产。

四、典型应用场景

SX1M25.000M10F30TNN的性能特点使其适用于以下场景:

  • 工业控制模块:PLC输入输出单元、传感器节点(如温度/压力传感器时钟源)
  • 物联网终端:LoRa/NB-IoT模块(需稳定时钟同步)
  • 通信接口电路:UART、SPI、I2C接口的25MHz时钟基准
  • 车载电子周边:车载显示屏、OBD诊断模块(符合宽温要求)
  • 消费电子:智能手环、蓝牙耳机的辅助时钟(低功耗+小封装)

五、品牌与可靠性保障

星通时频(SCTF)是国内专注频率控制器件的专业厂商,该型号经过严格可靠性测试:

  • 高低温循环(-40℃~+85℃,100次循环)
  • 振动测试(10~2000Hz,1g加速度)
  • 冲击测试(100g峰值加速度,1ms持续时间)
    产品参数一致性好,供货周期稳定,可满足批量生产需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.