WMSIC Electronic Components

SM4614BPRL

ModelSM4614BPRL
PackageSOP-8
BrandSPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SPS SM4614BPRL
Type
SPS
Minimum package
3000

Technical parameters

Electronic Component
SPS
Electronic Component
SM4614BPRL
Electronic Component
1
Package
SOP-8
Electronic Component
1 N +1 P
Electronic Component
0.199g
Electronic Component
1
Electronic Component
BM0265847320
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
3.1W
Electronic Component
3000
Voltage(Vdss)
40V
Capacitor(Ciss)
1.146nF
Resistor(RDS(on))
44.1mΩ@10V
Voltage(Vgs(th))
1.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SM4614BPRL 场效应管产品概述

SM4614BPRL是美国源芯(SPS)推出的互补型N沟道+P沟道场效应管(MOSFET),采用SOP-8贴片封装,专为低压、紧凑空间、需互补驱动的应用场景设计。产品整合了N和P两种沟道MOSFET,既节省PCB布局空间,又降低BOM成本,同时具备低导通电阻、低栅极电荷等优势,可满足工业级宽温环境下的稳定工作需求。

一、产品核心定位与应用场景

SM4614BPRL定位于低压互补驱动MOSFET,核心优势在于将N沟道和P沟道集成于单一封装,解决了传统“N+P”分立方案的空间占用和成本问题。其应用场景覆盖:

  • 便携式电子设备的电源管理(如手机、平板、智能穿戴的DC-DC转换、负载开关);
  • 小型电机驱动(玩具、无人机、智能家居的微型直流电机控制);
  • 电池保护电路(双向过流/过压保护,利用互补沟道实现双向阻断);
  • 音频辅助电路(低功耗音频放大的互补驱动级);
  • 工业控制中的低压信号驱动(如传感器信号放大、小功率执行器控制)。

二、关键电性能参数解析

SM4614BPRL的电性能参数针对低压高频应用做了优化,核心参数如下:

  1. 电压与电流能力
    漏源电压(Vdss)为40V,连续漏极电流(Id)达6A,可满足大多数低压(5V~24V)系统的电流需求,避免过压击穿风险,同时留有一定余量应对短时间过流(如电机启动)。
  2. 导通特性
    导通电阻(RDS(on))仅44.1mΩ@10V/6A,低导通电阻可显著降低导通损耗(导通损耗=I²×RDS(on)),减少设备发热;栅极电荷(Qg)为[email protected],低栅极电荷意味着开关速度快,适合几十kHz的高频DC-DC转换应用。
  3. 电容特性
    输入电容(Ciss)1.146nF@15V,反向传输电容(Crss)85pF@15V,低电容值可减少开关过程中的米勒效应(Miller Effect),进一步提升开关效率,降低电磁干扰(EMI)。
  4. 阈值与功率
    阈值电压(Vgs(th))1.3V@250uA,适合低电压栅极驱动(如3.3V/5V逻辑电平),无需额外升压电路;功耗(Pd)3.1W,搭配合理散热设计(如PCB铜箔面积≥20mm²)可满足连续工作需求。
  5. 温度范围
    工作温度覆盖-55℃~+150℃,达到工业级温度标准,可适应户外、车载等宽温环境,经过高低温循环测试,可靠性更高。

三、封装与可靠性设计

  1. 封装形式
    采用SOP-8(SOIC-8)贴片封装,尺寸紧凑(典型尺寸:5.0mm×3.9mm×1.5mm),适合高密度PCB布局,尤其适合便携式设备的小空间设计(如智能手表、蓝牙耳机的主板)。
  2. 互补集成优势
    单一封装整合N和P沟道MOSFET,相比分立方案减少2个元件,降低PCB布线复杂度,同时减少焊接点(从4个引脚变为8个引脚的集成焊接),提升生产良率。
  3. 可靠性设计
    • 抗静电能力:符合工业级ESD标准(典型值±2kV HBM、±200V MM),避免生产/使用中的静电损坏;
    • 过压防护:Vdss参数留有10%余量,可承受短时间过压冲击(如电源瞬态尖峰);
    • 热稳定性:封装采用导热性良好的塑料材料,配合宽温范围设计,可稳定工作在高温环境(如车载中控台的高温环境)。

四、品牌与选型优势

SM4614BPRL由美国源芯(SPS)生产,该品牌专注于功率半导体器件,产品以“高可靠性、高性价比”著称:

  1. 集成化方案优势:互补沟道集成,节省空间与成本,是替代分立N+P MOSFET的理想选择(可节省约30%的PCB面积);
  2. 性能均衡性:低导通电阻与低栅极电荷的平衡,既降低导通损耗,又提升开关效率,适合“低功耗+高频”的双重需求;
  3. 工业级可靠性:宽温范围、抗ESD等设计,满足工业、车载等严苛场景(如户外充电桩的辅助电路);
  4. 供应稳定性:SPS具备成熟的产能,可满足批量生产需求,交货周期稳定(典型交货期1~2周)。

五、典型应用场景详解

以便携式设备的DC-DC转换电路为例:

  • 场景需求:将5V输入转换为3.3V输出,需高效、小空间、低功耗;
  • 产品应用:SM4614BPRL的N沟道用于同步整流,P沟道用于开关控制,互补驱动可提升转换效率(典型效率达92%以上);
  • 优势体现:低RDS(on)减少整流损耗(5V转3.3V时,损耗可降低至0.05W以下),低Qg提升开关速度(开关频率可达100kHz),SOP-8封装节省PCB空间(仅占19.5mm²),宽温范围适应户外使用(如户外手持POS机)。

再如小型电机驱动:

  • 场景需求:控制微型直流电机的正反转,需双向驱动;
  • 产品应用:N沟道和P沟道分别控制电机正反转的电源路径,互补导通可实现双向电流控制,无需额外继电器,简化电路;
  • 优势体现:6A的连续电流满足电机启动/运行需求(启动电流约3倍连续电流),低导通电阻减少电机发热(温度可降低5℃以上),提升续航时间。

SM4614BPRL是一款针对低压互补驱动场景优化的集成MOSFET,凭借集成化设计、低损耗性能、工业级可靠性,可广泛应用于便携式电子、小型电机驱动、电池保护等领域,是替代传统分立方案的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.