Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
YJA3134KB是扬杰科技推出的超小型低功耗N沟道MOSFET,针对便携电子、低功耗电路及高密度PCB设计场景优化,具备宽温耐受、快速开关、低导通损耗等核心特性,可满足多数3.7V/5V电池供电系统的电源管理需求。
该器件聚焦小功率低电压应用,尤其适合对封装尺寸、功耗及可靠性要求较高的场景,典型应用包括:
YJA3134KB的参数设计围绕“低功耗、易驱动、快速开关”核心需求,关键特性如下:
漏源击穿电压Vdss=20V,连续漏极电流Id=700mA,完全覆盖主流3.7V锂电池(满电4.2V)及5V USB供电系统的电压范围,满足多数小功率负载的电流需求。
在1.8V栅源电压(Vgs)下,RDS(on)仅700mΩ——这一参数直接匹配多数MCU的IO输出电压(如STM32、ESP32等常见MCU的IO可输出1.8V/3.3V),无需额外驱动电路即可实现低损耗导通,有效降低电源路径的压降与功耗。
栅极电荷量Qg=1nC(@4.5V Vgs),输入电容Ciss=56pF、反向传输电容Crss=2.5pF(@10V Vds)——低电容值意味着开关延迟小、损耗低,适合高频小信号应用(如同步整流、快速负载切换)。
工作温度范围覆盖-55℃~+150℃,符合工业级器件的温度要求,可适应户外传感器、车载小模块等极端环境场景。
栅源阈值电压Vgs(th)=1.1V(@250μA Id),阈值低且一致性好,既保证易被MCU驱动,又避免低电压下的误导通风险。
YJA3134KB采用DFN-3(0.6×1mm)超小型封装,尺寸仅为常规SOT-23封装的1/3左右,极大节省PCB布局空间,适合高密度集成设计(如TWS充电盒内部紧凑布局)。
此外,扬杰科技针对该封装优化了散热路径,虽最大耗散功率Pd=360mW,但在小电流低功耗场景下可稳定工作;同时器件具备基础ESD防护能力,提升电路抗静电干扰性能,降低现场失效风险。
对比同类同参数MOSFET,YJA3134KB的核心优势包括:
综上,YJA3134KB是一款专为低功耗便携场景设计的高性价比N沟道MOSFET,可有效解决小功率电源管理中的“小型化、低损耗、易驱动”需求,适合各类便携电子及低功耗电路设计。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products