WMSIC Electronic Components

YANGJIE HS2MA

ModelHS2MA
PackageSMA(DO-214AC)
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE HS2MA
Type
SMA(DO-214AC)
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
HS2MA
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
0.12g
Electronic Component
1
Electronic Component
BM0229463323
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HS2MA 快恢复/高效率二极管 产品概述

HS2MA 是扬杰(YANGJIE)推出的一款高压、快恢复、适用于中等功率整流和开关场合的表面贴装二极管。封装为 SMA (DO-214AC),在保证耐压与浪涌能力的同时,具备较短的反向恢复时间和较低的反向漏流,适合开关电源、逆变器及各种需要高速整流的电路应用。

一、主要电气参数

  • 正向压降 (Vf):1.7 V @ If = 2.0 A
  • 额定直流反向耐压 (Vr):1000 V
  • 平均整流电流:2 A
  • 反向漏电流 (Ir):典型 5 μA(测试条件请参照厂方数据)
  • 反向恢复时间 (Trr):75 ns(快恢复特性,有利于减小开关损耗与电磁干扰)
  • 非重复峰值浪涌电流 (Ifsm):50 A(单次冲击,短时浪涌能力强)
  • 工作结温范围:-65 ℃ ~ +150 ℃
  • 封装:SMA (DO-214AC),表面贴装型

二、产品特性与优势

  • 高耐压:1000 V 的反向耐压使其适用于高电压整流与保护场合。
  • 快速恢复:75 ns 的反向恢复时间相比普通整流二极管大幅降低逆向恢复电流,减少开关损耗与热耗散,有利于提高系统效率。
  • 低漏电:典型漏电流仅 5 μA,在高压下保持较小的静态损耗,适合对漏电敏感的设计。
  • 良好浪涌能力:50 A 的单次浪涌能力适合应对启动冲击或瞬间过载情形。
  • 宽温度范围:-65 ℃ 至 +150 ℃ 的结温范围,适应恶劣环境与高温运行工况。
  • 贴片封装:SMA 封装便于自动化贴装与批量生产,兼顾占板面积与热性能。

三、典型应用场景

  • 开关电源(SMPS)二次整流
  • 功率因数校正(PFC)电路中的高压整流
  • 逆变器、UPS、太阳能逆变单元中的整流与钳位
  • 电动机驱动、充电器、适配器等需要快恢复的整流模块
  • 高压保护、吸收钳位与续流二极管(freewheeling)

四、设计注意事项与建议

  • 电流及散热考量:标称平均整流电流为 2 A,实际使用时应根据 PCB 散热能力与环境温度做适当降额,增加铜箔面积以改善散热。
  • 浪涌与并联:若系统存在频繁大电流冲击或较高脉冲功率,建议评估并联器件或改用更高浪涌等级型号。
  • 开关噪声与缓冲:尽管为快恢复二极管,但在高频高速开关中反向恢复仍会产生尖峰电流,必要时在电路中配合 RC 缓冲、吸收电路或适当布局来抑制 EMI。
  • 焊接与可靠性:采用标准 SMT 回流焊工艺,遵循厂商推荐的焊接温度曲线以保证可靠性与性能;长时间高温工作会影响寿命,设计上应留有热余量。
  • 极性与布局:SMA 封装极性明显,PCB 布局应保证热经由焊盘良好传导至铜层,并尽量缩短电流回路以降低寄生电感。

五、封装与采购信息

  • 封装类型:SMA(DO-214AC),表面贴装,适合自动化贴装与回流焊。
  • 品牌:YANGJIE(扬杰电子) HS2MA。
  • 订购时请确认完整料号、包装形式(卷盘数量)及最新的器件规格表,以便获得完整的热阻、典型特性曲线及封装尺寸信息。

总结:HS2MA 将高达 1kV 的耐压与 75 ns 的快恢复特性结合在紧凑的 SMA 封装中,是中高压开关电源与整流场合的实用选择。在实际设计中注意热管理与开关噪声抑制,即可充分发挥其高效率与可靠性优势。若需更详细的曲线数据或可靠性认证信息,建议参考扬杰官方数据手册或联系供应商获取原厂技术支持。

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