WMSIC Electronic Components

YANGJIE SS210AQ

ModelSS210AQ
PackageSMA(DO-214AC)
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE SS210AQ
Type
SMA(DO-214AC)
Minimum package
7500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
SS210AQ
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
0.11g
Electronic Component
1
Electronic Component
BM0264690131
Electronic Component
Electronic Component
Electronic Component
7500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS210AQ 产品概述 — YANGJIE(扬杰)

一、性能概述

SS210AQ 为单颗独立整流二极管,采用 SMA(DO-214AC)封装,面向中等功率整流和开关保护应用。器件在2A工作电流下正向压降仅约0.8V,反向耐压可达100V,适用于常见的直流电源、降压/升压转换和反向保护电路。工作结温范围宽,-55℃ 至 +175℃,可在苛刻环境下保持稳定性能。

二、主要技术参数

  • 二极管数量:1个独立式
  • 正向压降(Vf):0.8V @ 2A
  • 直流反向耐压(Vr):100V
  • 额定整流电流:2A(直流)
  • 反向漏电流(Ir):1µA @ 100V
  • 非重复峰值浪涌电流(Ifsm):75A
  • 工作结温范围:-55℃ ~ +175℃
  • 封装:SMA (DO-214AC)
  • 品牌:YANGJIE(扬杰)

三、典型应用场景

  • 开关电源的输入/输出整流和续流(二极管放电回路)
  • 电池充放电与反接保护(防止反接或回流)
  • 车载电子、工业控制与家电的功率整流与保护
  • 器件作为浪涌抑制、半波整流或同步整流电路的备用件

四、封装与热管理建议

SMA(DO-214AC)封装体积小、适合自动贴装,但热阻相对较高。工作电流2A时,按Vf≈0.8V估算连续功耗约为1.6W,实际温升与PCB铜箔面积、铺铜和过孔数直接相关。推荐做法:

  • 在器件下方和两侧增加大面积铜箔,必要时加导热过孔至内层或底层散热层;
  • 在高脉冲或高温环境下考虑更大的散热面积或并联器件降额使用;
  • 焊接工艺遵循SMA封装回流曲线,避免过热影响可靠性。

五、设计与使用注意事项

  • 反向漏电流在满耐压时为1µA,适合大多数低功耗场景,但在超低漏电应用需评估;
  • 峰值浪涌电流Ifsm=75A为非重复峰值,适用于瞬态浪涌吸收(例如开机浪涌、整流器冲击),设计时仍应考虑热容和重复脉冲情况下的退化;
  • 在高温环境或连续满载时应进行热仿真或实际温升测试,必要时进行电流降额;
  • 与其它器件并联使用时注意电流共享与正向压降一致性。

六、可靠性与采购参考

  • 工作结温范围宽、耐热性能好,适合汽车级或工业级温度需求的边界应用;
  • SMA 封装便于自动化贴装与波峰/回流焊接,适合批量生产。
  • 选型时可依据上述参数比对同类整流二极管的Vf、Ir及Ifsm,以满足具体应用的效率与可靠性要求。

如需原厂数据手册(Datasheet)、封装尺寸图或焊接推荐曲线,可向供应商或经销渠道索取详细资料,以便完成最终电路设计和可靠性验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.