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YANGJIE H1D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- YANGJIE H1D
- Type
- SOD-123
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YANGJIE
- Electronic Component
- H1D
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- 0.037g
- Electronic Component
- 1
- Electronic Component
- BM0231132711
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
H1D 产品概述
一、主要参数与特性
H1D 是一款面向通用整流和开关保护的表贴二极管（SOD-123FL 封装），其关键电气参数如下：正向压降 Vf = 1.3V @ 1.0A，直流反向耐压 Vr = 200V，额定整流电流 IF(AV) = 1A，静态反向漏电流 Ir ≈ 5μA，反向恢复时间 Trr = 50ns，非重复峰值浪涌电流 Ifsm = 30A，工作结温范围 -55℃～+150℃。这些参数表明 H1D 在中等电压和中等频率的整流、开关场合具有良好的综合性能。
二、性能解读与工程意义
- 正向压降 1.3V（1A）意味着在连续 1A 条件下二极管自身会产生约 1.3W 的功耗，需在 PCB 设计中考虑散热和热阻。
- 200V 的反向耐压适合多数中低压电源、适配器与保护应用。
- 50ns 的反向恢复时间表示它属于快速恢复类别，适合数十 kHz 到数百 kHz 的开关频率，但在高频（MHz 级）场合可能需考虑更高速或肖特基方案以降低开关损耗与电磁干扰。
- Ifsm=30A 的冲击能力可应对开机涌流或短时浪涌，但属于非重复峰值，勿在重复冲击条件下使用。
三、封装与热管理建议
SOD-123FL 为紧凑的表面贴装封装，适合体积受限的消费电子、电源和照明产品。由于封装体积较小，建议在 PCB 上配备足够的铜箔面积并使用过孔散热至内层或反面铜箔，以降低结温并保证长期可靠性。实际设计时应按最大结温 150℃进行电流热功率余量设计并考虑环境温度与通风条件。
四、典型应用场景
- 开关电源的整流与续流二极管（中低频）
- 适配器、充电器、家电与工业电源的输出整流与反向保护
- 过压/反向接法保护、续流二极管、整流桥（并联/分流注意一致性）
- 有限频率的降压/升压电路中作为快速恢复整流元件
五、选型与使用注意
- 若关注更低正向压降或更高效率（尤其高频），可考虑肖特基二极管；需权衡耐压与漏电流。
- 测试与规格值通常在特定条件下测得（如温度、测试电流/电压），实际工程应用请参照厂商完整数据表并按实际环境进行热仿真与寿命评估。
- 安装时遵循封装的焊接曲线，避免过热；存储与使用时注意结温、湿敏等级及 ESD 防护。
如需该型号的完整数据手册、PCB 尺寸图或 SPICE 模型，我可以帮您检索或生成适配建议。
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