WMSIC Electronic Components

YANGJIE GR1M

ModelGR1M
PackageSMA(DO-214AC)
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE GR1M
Type
SMA(DO-214AC)
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
GR1M
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
0.131g
Electronic Component
1
Electronic Component
BM0230875397
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GR1M 产品概述 — YANGJIE(扬杰)快恢复/高效率二极管

一、产品简介

GR1M 为扬杰(YANGJIE)推出的一款独立式快恢复/高效率二极管,采用 SMA (DO-214AC) 封装,面向高电压整流与开关电源应用。器件具有高达 1kV 的反向耐压与 1A 的连续整流能力,正向压降仅为 1.3V(在 1A 条件下),兼顾电源效率与抗压能力,适用于高压直流回路的整流、钳位和续流保护。

二、主要电气参数

  • 器件型号:GR1M
  • 品牌:YANGJIE(扬杰)
  • 封装:SMA (DO-214AC),独立式二极管
  • 正向压降:Vf = 1.3V @ If = 1A
  • 直流反向耐压:Vr = 1 kV
  • 连续整流电流:If = 1 A
  • 反向电流:Ir = 5 μA @ Vr = 1 kV
  • 反向恢复时间:Trr = 500 ns(快恢复型)
  • 非重复峰值浪涌电流:Ifsm = 30 A
  • 工作结温范围:Tj = -55 ℃ ~ +150 ℃

三、产品特性与优势

  • 高压等级:1kV 的反向耐压使 GR1M 能胜任高压直流侧的耐压要求,如 PFC、开关电源高压整流和高压隔离电路。
  • 低正向压降:1.3V(1A)有助于降低导通损耗,提高系统效率,尤其在中高电流工作点下更明显。
  • 快恢复特性:Trr = 500ns 的恢复时间比普通整流二极管明显更快,可降低开关损耗与反向恢复引起的电磁干扰(EMI),适合中速开关场景。
  • 较小反向漏电:5 μA @ 1kV 的低反向电流有利于高压电路中的静态损耗控制和可靠性。
  • 良好浪涌承受力:30A 的峰值浪涌电流能应付启动或短时过载条件,提高抗脉冲能力。
  • 标准封装:SMA 封装便于自动化贴装和热管理,空间占用小,可靠性高。

四、典型应用场景

  • 开关电源(SMPS)高压整流或续流二极管
  • 功率因数校正(PFC)段高压整流
  • 逆变器与变频器的高压保护或钳位电路
  • 高压充电器、医疗设备高压整流(需结合具体安规选择)
  • 工业电源、太阳能逆变器的局部整流或防反接保护

五、设计与使用建议

  • 结温管理:尽管器件允许最高 Tj 达到 +150 ℃,但为延长寿命与保证可靠性,设计时应考虑充分散热或在电路板上留出热通道。
  • 电流与散热余量:1A 为连续整流电流的额定值,如工作在高温或靠近额定值,建议做适当降额(derating)。
  • 抑制反向恢复影响:在高频切换场合,500ns 的恢复时间仍会产生反向恢复峰值电流和电压应力,建议配合 RC 缓冲、吸收电阻或合理的开关器件选型与布局来抑制过冲与 EMI。
  • 浪涌情形设计:Ifsm = 30A 能承受短时浪涌,但若系统存在频繁脉冲,应评估能否引入限流元件或更高峰值能力的器件。
  • PCB 布局:减少回流环路面积,靠近热源布局散热铜箔,保持环路短且粗,以降低寄生电感与发热。

六、封装与可靠性

SMA (DO-214AC) 为商用功率二极管常见封装,适合自动贴装与回流焊工艺。器件工作结温范围宽(-55 ℃ ~ +150 ℃),适应工业级环境。实际量产与可靠性评估时仍建议参考扬杰提供的完整数据手册和可靠性测试报告(振动、温循环、焊接热稳定性等)。

七、结语与选型提示

GR1M 在 1kV 耐压、较低正向压降与快恢复性能之间取得平衡,适合对高压整流、效率和抗反向恢复有一定要求的应用场合。最终选型请结合实际工作电流、开关频率、热设计与安规要求,必要时参考厂商完整 Datasheet 并做样品测试以确认在目标系统中的表现。若需更高频率、 更短恢复时间或更大持续电流的替代品,可考虑快恢复二极管家族中更高规格型号或肖特基/SiC 器件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.