Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YANGJIE SS115A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YANGJIE SS115A
- Type
- SMA
- Minimum package
- 5000 卷
Technical parameters
- Electronic Component
- YANGJIE
- Electronic Component
- SS115A
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.128g
- Electronic Component
- 1
- Electronic Component
- BM0265668398
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 100uA@150V
- (Vf)
- 900mV@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- Voltage Rating(Vr)
- 150V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS115A肖特基二极管产品概述
一、产品基本定位与品牌背景
SS115A是扬杰科技（YANGJIE）推出的独立式肖特基整流二极管，属于中小功率器件范畴，专为150V以下电压等级的整流、续流等场景设计。扬杰科技作为国内功率半导体领域的成熟厂商，其产品在消费电子、工业控制等领域广泛应用，SS115A依托扬杰的芯片设计与封装工艺，兼顾性能与成本，适合各类常规电子电路的集成需求。
二、核心电性能参数解析
SS115A的关键电参数围绕“中小功率、低损耗”核心设计，具体如下：
- 整流电流（IF）：额定连续正向电流为1A，满足多数小型电子设备的电流需求，如小功率适配器、LED驱动等；
- 反向耐压（VRRM）：直流反向重复峰值电压150V，确保在150V以内反向截止时绝缘性能可靠，避免击穿；
- 正向压降（VF）：1A负载下仅900mV，远低于普通硅整流二极管（通常1V以上），能显著降低导通损耗，提升电路效率；
- 反向漏电流（IR）：150V反向电压下漏电流≤100μA，反向截止时功率损耗极小，且长期工作稳定性好；
- 工作结温范围：-55℃至+150℃，宽温范围覆盖了工业级（-40℃~+85℃）与部分高温场景，适应不同环境需求。
三、封装与物理特性
SS115A采用SMA（DO-214AC）表面贴装封装，是中小功率肖特基二极管的主流封装形式：
- 尺寸紧凑：表面贴装设计无需插件孔，节省PCB空间，适合高密度电路集成；
- 散热适配：封装热阻可满足1A电流下的功耗需求（1A×0.9V=0.9W），无需额外散热片即可稳定工作；
- 独立式封装：单个器件独立封装，便于焊接与更换，兼容性强，可与其他SMA封装器件互换。
四、典型应用场景
结合参数特性，SS115A的典型应用集中在以下领域：
- 开关电源输出整流：如手机充电器、路由器、机顶盒等小功率适配器的次级整流，低VF降低电源损耗，提升转换效率；
- DC-DC转换器续流：在buck/boost等低压直流变换电路中作为续流二极管，肖特基无反向恢复时间的特性适合高频工作，避免电压尖峰；
- 小型电子设备整流：玩具、小家电（加湿器、台灯）、LED驱动电源的整流环节，满足小电流、低损耗需求；
- 工业控制辅助电路：传感器信号整流、小型继电器续流、PLC输入输出接口保护电路等，宽温范围适应工业环境温度波动。
五、可靠性与环境适应性
SS115A的可靠性体现在：
- 宽温稳定：工作结温覆盖-55℃~+150℃，满足民用、工业级等多场景；
- 低漏电流稳定：反向漏电流在全温范围内控制良好，长期工作无明显参数漂移；
- 环保合规：符合RoHS无铅要求，适配绿色电子产品设计；
- 批次一致性：扬杰标准化生产流程确保同批次器件参数偏差小，便于批量生产。
SS115A以“低VF、小封装、宽温适应”为核心优势，是中小功率整流、续流场景的高性价比选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
