Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YANGJIE SS16AQ
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YANGJIE SS16AQ
- Type
- SMA(DO-214AC)
- Minimum package
- 7500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YANGJIE
- Electronic Component
- SS16AQ
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.112g
- Electronic Component
- 1
- Electronic Component
- BM0230875406
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 500uA@150V
- (Vf)
- 700mV@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 7500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS16AQ 产品概述 — YANGJIE(扬杰)
一、简介
SS16AQ 是扬杰（YANGJIE）推出的一款独立式肖特基二极管，封装为 SMA (DO-214AC)。凭借低正向压降与快速恢复特性，本器件适用于开关电源、整流与反向保护等场合，兼顾高效率与可靠性。
二、主要特性
- 型号：SS16AQ
- 品牌：YANGJIE（扬杰）
- 封装：SMA (DO-214AC)，独立式器件，便于自动贴装与手工焊接
- 正向压降：Vf = 700 mV @ IF = 1 A（低压降，降低功耗）
- 直流反向耐压：VR = 60 V
- 线性整流电流：IF(AV) = 1 A
- 反向漏电流：IR = 500 μA @ VR = 150 V（注意：测试电压高于额定VR，实际工作中漏电依温度和电压变化）
- 非重复峰值浪涌电流：IFSM = 30 A（短时冲击能力良好）
- 工作结温范围：TJ = -55 ℃ ~ +150 ℃
三、优势说明
- 低正向压降：700 mV 在 1 A 工作点下能显著减少整流损耗，提升系统效率，尤其适合低压大电流拓扑。
- 高浪涌承受力：30 A 峰值冲击电流可应对瞬态负载与开机冲击。
- 宽工作温度：适合工业级环境和高温应用。
- SMA 封装：热性能与机械强度兼顾，适合波峰/回流焊及自动化装配。
四、典型应用
- 开关电源二次整流
- 逆向保护与防反接电路
- 电池充放电路径中的整流与保护
- 低压降电源管理与肖特基钳位电路
五、选型与使用建议
- 若需在 60 V 以上持续工作，请选用更高 VR 等级器件；避免长期在 150 V 下工作以免漏电增大。
- 在高电流或高散热工况下，应配合良好散热布局或散热片，避免结温超出额定范围。
- 焊接时遵循封装温度曲线，避免过热影响可靠性。
- 对于对漏电流敏感的应用，需在电路设计时考虑温漂与最大 IR 值带来的影响。
六、封装与可靠性
SMA (DO-214AC) 提供了较好的热阻与机械稳定性，适用于自动化生产线。器件满足工业级温度与冲击指标，适合长期可靠运行。
总结：SS16AQ 在保持低正向压降和良好浪涌承受能力的同时，提供了适合多种电源及保护场景的稳定性能，是一款性价比较高的肖特基整流选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
