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YANGJIE SS34AQ
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- YANGJIE SS34AQ
- Type
- SMA(DO-214AC)
- Minimum package
- 7500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YANGJIE
- Electronic Component
- SS34AQ
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- 0.1g
- Electronic Component
- 1
- Electronic Component
- BM0230814844
- Electronic Component
- Electronic Component
- Electronic Component
- 7500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS34AQ 产品概述
一、主要参数
SS34AQ 为扬杰（YANGJIE）车规级肖特基整流二极管，关键电气参数如下：
- 正向整流电流：3A（DC）
- 直流反向耐压（Vr）：40V
- 正向压降（Vf）：500mV @ 3A
- 非重复峰值浪涌电流（Ifsm）：80A
- 反向电流（Ir）：100µA @ 40V
- 工作结温范围：-55℃ ~ +150℃
- 封装：SMA (DO-214AC)
二、产品特性
SS34AQ 采用肖特基结结构，具备低正向压降与快速恢复特性，能够在高电流下减少功耗与热量产生；80A 峰值冲击能力提供良好的抗浪涌性能；工作结温范围宽、反向电流小，适应恶劣温度与汽车电子对稳定性的要求。SMA 表面贴装封装兼顾体积与散热，可适应自动化生产线回流焊工艺。
三、典型应用
- 汽车电子系统：电源保护、反向极性保护、电源整流
- 开关电源与DC-DC转换器：续流/钳位二极管
- 电池供电设备与充电电路：低压降整流以提高系统效率
- 工业级电源模块与过流/浪涌抑制场景
四、封装与热管理
SMA (DO-214AC) 封装便于SMD贴片安装，建议在PCB设计中采用较宽的焊盘与充足的铜箔散热区，并在大电流路径处使用多层铜铺和过孔通热设计以降低结-环境热阻。实际持续电流能力受PCB散热与环境温度影响，推荐按工作结温上限进行热设计和电流降额。
五、设计与使用建议
- 在高电流或高环境温度场合进行热仿真与降额设计，保证结温低于150℃。
- 对存在较大浪涌或启动冲击的系统，考虑并联设计或增加浪涌保护元件以延长寿命。
- 回流焊接兼容常规无铅工艺，建议参照厂家焊接与回流温度曲线进行工艺控制。
- PCB布局时尽量缩短电流环路并增加散热铜箔，提高可靠性。
六、可靠性与选型建议
SS34AQ 标注为车规级，适配汽车工作环境的宽温和高可靠性需求。选型时除了电压、电流、压降与浪涌能力外，还应关注系统的散热能力、反向泄漏在高温下的增长，以及是否需要通过具体车规认证或试验记录。对于关键汽车电子模块，建议与供应商确认器件的质量体系与可靠性测试报告。
总结：SS34AQ 以其低压降、高浪涌能力和宽温特性，适合要求高可靠性与高效率的车载及工业电源场景。在实际应用中结合良好的PCB热设计与合适的电流降额策略，可发挥其最佳性能。
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