WMSIC Electronic Components

YANGJIE YJS7328B

ModelYJS7328B
PackageSOP-8-Dual
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE YJS7328B
Type
SOP-8-DUAL
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
YJS7328B
Electronic Component
1
Package
SOP-8-Dual
Electronic Component
0.189g
Electronic Component
1
Electronic Component
BM0265007240
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YJS7328B 产品概述

一、产品概述

YJS7328B 为扬杰(YANGJIE)推出的双通道 P 沟道沟槽功率 MOSFET,封装为 SOP-8-Dual,集成两颗低压大电流 P 沟道器件。采用高密度单元工艺,兼顾低导通电阻与高速开关性能,适合要求高效率、高集成度的功率开关与保护电路。

二、主要参数

  • 数量:2 个 P 沟道
  • 漏源电压 Vdss:30 V
  • 连续漏极电流 Id:10 A
  • 导通电阻 RDS(on):20 mΩ(|VGS|=10 V)
  • 阈值电压 VGS(th):约 2.5 V
  • 总栅极电荷 Qg:24 nC(|VGS|=10 V)
  • 输入电容 Ciss:1.22 nF;反向传输电容 Crss:160 pF;输出电容 Coss:170 pF
  • 功耗 Pd:2.5 W
  • 湿度敏感度:MSL 3;环氧树脂符合 UL 94 V-0;无卤素材料

三、关键特性

  • 低 RDS(on):高密度单元设计带来低导通损耗,有利于减少导通发热和提高效率。
  • 快速开关:适配高频开关应用,栅极电荷与寄生电容在设计开关速度时易于估算与优化。
  • 集成双通道:两路 P 沟道器件在 SOP-8-Dual 内,可节省 PCB 空间并简化驱动与布局。
  • 安全与环保:通过 V-0 级阻燃树脂封装与无卤材料,满足常见安全与环保要求。

四、典型应用

  • 便携式电源和电池管理的高侧开关与反向电流隔离
  • 电源管理开关(负载开关、反向保护)
  • 电源路径选择与电源切换模块
  • 需要双通道 P 沟道封装的空间受限场合

五、设计与使用建议

  • 驱动:由于为 P 沟道器件,开通时需对栅极施加相对于源的适当负向驱动,通常以 |VGS|=10 V 时能达到标称 RDS(on)。为控制开关损耗与振铃,建议采用限流或斜率控制的栅极驱动。
  • 布局:尽量缩短漏-源与栅极回路的走线,增大铜厚与散热面以降低温升。双通道封装提醒注意共用散热路径与热耦合效应。
  • 散热:Pd=2.5 W 为封装额定耗散,实际使用中需考虑 PCB 散热、环境温度和占空比进行热设计与降容。
  • EMI/谐振控制:Crss 与 Qg 值提示在高频切换时需要合理的 RC 或 Rg 抑制网络以降低电压切换速率导致的干扰。

六、可靠性与包装

YJS7328B 满足湿度敏感度等级 3,封装材料符合 UL94 V-0 阻燃要求并采用无卤工艺。SOP-8-Dual 封装便于波峰或回流焊接,适用于中小批量自动贴装生产。

如需更详细的电气特性曲线、热等效参数或布局示例图,请提供使用场景或电路拓扑,以便给出更具体的设计建议。

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