WMSIC Electronic Components

YANGJIE BZX584C5V6

ModelBZX584C5V6
PackageSOD-523(SC-79)
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE BZX584C5V6
Type
SOD-523(SC-79)
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
BZX584C5V6
Electronic Component
1
Package
SOD-523(SC-79)
Electronic Component
0.011g
Electronic Component
1
Electronic Component
BM0265872179
Electronic Component
Electronic Component
Electronic Component
8000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX584C5V6稳压二极管产品概述

BZX584C5V6是扬杰科技(YANGJIE)推出的超小型表面贴装稳压二极管,采用SOD-523(SC-79)封装,具备低漏电流、宽温度范围、高空间效率等核心优势,广泛适用于低功耗电子系统的电压基准、稳压或过压保护场景。

一、产品基本属性

类别 详情 品牌 扬杰科技(YANGJIE) 器件类型 稳压二极管(齐纳二极管) 封装形式 SOD-523(SC-79)超小型表面贴装封装 配置方式 独立式单管封装 核心功能 反向击穿实现5.6V稳定电压输出

二、核心电气参数详解

该器件的电气性能围绕稳压精度、功耗效率、环境适应性三个维度设计,关键参数如下:

1. 稳压特性

  • 标称稳压值:5.6V(典型工作电压);
  • 稳压范围:5.2V~6V(额定条件下电压波动区间,满足一般精度需求);
  • 反向漏电流(Ir):1μA@2V反向电压(漏电流极低,可显著降低静态功耗,适配电池供电场景)。

2. 功率与阻抗

  • 最大耗散功率(Pd):200mW(器件允许的最大功率损耗,需结合电路电流控制实际功率);
  • 动态阻抗(Zzt):40Ω(测试电流下的阻抗,阻抗越低稳压特性越稳定);
  • 膝点阻抗(Zzk):200Ω(反向击穿膝点附近的阻抗,反映低电流下的稳压性能)。

3. 温度特性

  • 工作结温范围:-55℃~+150℃(宽温覆盖工业级、部分汽车级场景,适应高低温环境下的稳定工作)。

三、封装与机械特性

SOD-523封装是超小型表面贴装结构,机械特性适配高密度PCB设计:

  • 尺寸:典型1.6mm(长)×0.8mm(宽)×0.6mm(高),体积仅为传统DO-35封装的1/5,大幅节省PCB空间;
  • 引脚与极性:2引脚设计,阴极通常带有黑色/白色标记(实物为准),便于安装识别;
  • 焊接兼容性:支持回流焊、波峰焊等常规工艺,焊接峰值温度需控制在260℃以内(避免热应力损坏);
  • 可靠性:环氧树脂封装具备抗冲击、抗振动能力,适合便携式设备的移动场景。

四、典型应用场景

基于参数特性,BZX584C5V6主要应用于以下领域:

  1. 可穿戴设备:智能手环、蓝牙耳机等的传感器/MCU基准电压;
  2. 便携式通信:手机射频前端、无线耳机的过压保护电路;
  3. 工业控制:PLC模块、传感器节点的稳压电路(适配-55℃~+150℃宽温);
  4. 消费电子:充电器、电源适配器的辅助稳压(提升输出稳定性);
  5. 汽车电子(部分场景):车载小功率传感器的电压基准(需符合汽车级可靠性要求)。

五、使用注意事项

为确保器件稳定工作,需注意以下要点:

  1. 功率限制:实际耗散功率需≤200mW(公式:P=(V工作-V稳压)×I电流),避免过流烧毁;
  2. 极性识别:阴极(标记端)需接电路反向电压正极,接反会导致正向导通无法稳压;
  3. 温度管理:工作结温不超150℃,高温环境下需降低工作电流;
  4. 静电防护:属于静电敏感器件,操作时需佩戴防静电手环;
  5. 焊接工艺:回流焊时间≤10秒(260℃峰值),避免封装开裂。

总结

BZX584C5V6凭借小封装、低功耗、宽温特性,成为替代同类进口器件的优质选择,可满足各类低功耗、高密度电子系统的稳压需求,是扬杰科技在功率半导体领域的代表性稳压二极管产品。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.