Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YANGJIE HER208G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- YANGJIE HER208G
- Type
- DO-15
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YANGJIE
- Electronic Component
- HER208G
- Electronic Component
- 1
- Package
- DO-15
- Electronic Component
- 0.4g
- Electronic Component
- 1
- Electronic Component
- BM0230006663
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HER208G 产品概述
一、产品简介
HER208G 是扬杰（YANGJIE）推出的一款快恢复/高效率整流二极管，采用 DO-15 轴向封装，面向需要高耐压与开关性能兼顾的电力电子应用。器件标称直流反向耐压 1kV，平均整流电流 2A，适用于中高电压整流与开关场合。
二、主要参数与特性
- 正向压降 Vf：1.7V（在 2.0A 条件下）
- 平均整流电流 If(AV)：2A
- 直流反向耐压 Vr：1000V
- 反向电流 Ir：2.5μA（典型值）
- 反向恢复时间 Trr：75ns（快恢复特性，有利于减少开关损耗及交越失效）
- 非重复峰值浪涌电流 Ifsm：60A（用于短时冲击浪涌能力评估）
- 工作结温范围：-55℃ ～ +150℃
三、优势与适用场景
HER208G 结合了高耐压与较快反向恢复的优点，适合用于：
- 开关电源（SMPS）高压整流、次级整流
- flyback、buck/boost 等功率变换器的续流/整流回路
- 工业电源、LED 驱动、充电器与适配器中的高压整流
- 需要承受短时浪涌冲击的电力电子系统
四、电气与热管理建议
- 持续工作电流请以 If(AV)=2A 为基准，并考虑环境温度、散热条件进行降额使用。
- 器件功耗可按 P = I × Vf 估算，正向电流增加时正向压降与功耗都会增长，应保证良好散热以控制结温。
- Ifsm=60A 表示短时浪涌承受能力，通常用于单次或短脉冲条件（详见厂家浪涌定义），不可作为连续使用指标。
- 在高温环境下反向漏电流会显著增大，设计时需为温升留出裕量以保证可靠性。
五、PCB 布局与电磁兼容建议
- 将 HER208G 靠近开关节点或整流点布置，减少线路环路面积以降低寄生电感和电磁干扰。
- 在高频开关应用中，配合 RC/RCD 吸收网络或软恢复方案以缓解电压尖峰和 EMI。
- 必要时在热敏感区域增加散热体或使用更宽的铜箔以改善导热。
六、选型与注意事项
- 若对正向压降或开关损耗有更严格要求，可比较肖特基二极管或超快恢复（UFR）系列；但肖特基在耐压上通常受限，需权衡。
- 反向恢复时间 75ns 虽属快恢复范畴，但在极高频率或对换向冲击极敏感的场景仍需验证系统级表现。
- 选型时应参考完整数据手册，关注测试条件（如 Vf、Ir 的测试温度与电流），以及封装和引脚尺寸以满足装配要求。
七、采购与可靠性提示
HER208G 以 DO-15 常见轴向封装交付，适合通过手工焊接或波峰/选择性焊接装配。采购时建议向供应商确认批次合规性、认证与库存状态，并在样片验证阶段进行温升、浪涌与寿命测试，确保在目标应用中的长期可靠性。
总结：HER208G 在 1kV 高压等级下提供了快恢复与较高整流能力，适合中高压开关电源和整流场景。设计时关注散热、换向应力与系统 EMC，可发挥其高效率与耐压优势。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
