WMSIC Electronic Components

YANGJIE H1G

ModelH1G
PackageSOD-123
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE H1G
Type
SOD-123
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
H1G
Electronic Component
1
Package
SOD-123
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0230631409
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

H1G 开关二极管(YANGJIE 扬杰,SOD-123)

一、产品概述与核心卖点

H1G 为扬杰(YANGJIE)推出的开关二极管,额定反向耐压 400V、整流电流 1A,采用 SOD-123 表面贴装封装。该器件面向中低功率开关电源、开关保护与整流场景,具备较低的正向压降(Vf=1.7V @ 1.0A)、快恢复特性(Trr≈75ns)以及良好的浪涌承受能力(Ifsm=30A,非重复峰值),在体积、性能与成本之间提供平衡的解决方案。

二、主要电气与热参数(重点速览)

  • 正向压降:Vf = 1.7V @ IF = 1.0A(用于估算导通损耗)
  • 直流反向耐压:VR = 400V(适用于高压整流/保护)
  • 连续整流电流:IF = 1A(封装与热设计决定持续工作上限)
  • 反向电流:IR ≈ 5μA(典型静态泄漏,随温度上升增大)
  • 反向恢复时间:Trr ≈ 75ns(属于快恢复范畴,适合中高速开关)
  • 非重复峰值浪涌电流:Ifsm = 30A(短时抗冲击能力)
  • 工作结温:Tj = -55℃ ~ +150℃(宽温度范围,适应工业级环境)

示例热功耗:在 IF=1A 时,器件导通损耗约 Pd = Vf×IF = 1.7W;需按实际 PCB 散热条件计算结温上升并做电流/温度降额。

三、典型应用场景

  • 开关电源的次级整流或高压侧快速整流
  • 反并联作自由轮回路(flyback、SEPIC 等)
  • 输入浪涌抑制与反向保护(耐受瞬态浪涌)
  • 小功率桥式整流器或电源滤波后备路径
  • 瞬态抑制、续流与钳位应用(受限于反向恢复和Vf)

四、设计与使用建议

  • 散热设计:SOD-123 封装散热受限,若长期接近 1A,建议在 PCB 上加大铜箔、设置过孔或使用散热垫以降低结温并做电流降额。
  • 开关频率考虑:Trr≈75ns,适用于中等开关频率(数十 kHz 到几百 kHz);在高频下反向恢复电流可能增加损耗与EMI,必要时考虑更快恢复或肖特基器件。
  • 浪涌处理:Ifsm=30A 仅限非重复短脉冲,应避免重复大幅度浪涌;对有较大冷启动浪涌的系统,再加软启动或限流设计。
  • 温度与漏电:高温下 IR 会显著上升,需评估在高温工况下的漏电对电路的影响。
  • 焊接与存储:按照常规 SMD 工艺规范回流焊;存储与处理按一般潮湿敏感器件要求,避免长时间潮湿暴露。

五、封装、可靠性与选型提示

SOD-123 小体积易于自动贴装,适合空间受限的消费电子与工控产品。选型时如需更低正向压降或更短恢复时间,可比较肖特基或超快恢复二极管;若需承受更大持续电流或更强散热能力,可考虑更大功率封装(SMA、DO-214 等)。最后建议在具体设计中参考完整器件资料(详尽的温度依赖曲线、浪涌脉冲波形下的性能和封装尺寸),并在样机阶段对结温与电磁兼容性进行验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.