WMSIC Electronic Components

YANGJIE DTC123JUA

ModelDTC123JUA
PackageSOT-323
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE DTC123JUA
Type
SOT-323
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
DTC123JUA
Electronic Component
1
Package
SOT-323
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0265991714
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DTC123JUA 预偏置NPN晶体管产品概述

一、产品核心定位

DTC123JUA是扬杰(YANGJIE)推出的集成预偏置电阻的NPN型晶体管,采用超小型SOT-323贴片封装,专为低功耗、小电流场景下的开关控制与信号放大设计。该器件通过内置偏置电阻简化外部电路,无需额外配置偏置元件即可稳定工作,是便携设备、小型电子模块等领域的高性价比选择。

二、关键电气参数深度解析

1. 耐压与功率能力

  • 集射极击穿电压(Vceo):50V,可承受中等电压冲击,避免过压损坏;
  • 集电极最大电流(Ic):100mA,适配小电流负载驱动;
  • 最大耗散功率(Pd):200mW,满足低功耗场景需求,减少发热。

2. 电流增益与输入输出特性

  • 直流电流增益(hFE):在Ic=10mA、Vce=5V的典型工作条件下稳定为80,为信号放大提供可靠增益;
  • 输入特性:
    最小导通输入电压(VI(on))分两个典型场景:Ic=5mA时为1.1V,Ic=0.25mA(小电流)时降至0.3V;
    最大截止输入电压(VI(off)):Ic=100μA、Vce=5V时为500mV,确保可靠关断;
  • 输出特性:导通输出电压(VO(on))在Ic=5mA、Ib=0.25mA时仅300mV,压降小、损耗低;
  • 内置电阻参数:输入电阻2.86kΩ,电阻比率26,明确的内置电阻保证偏置电路一致性,无需外部调试。

三、封装与环境适应性

DTC123JUA采用SOT-323超小型贴片封装,尺寸紧凑(典型值1.6mm×0.8mm×0.6mm),可显著节省PCB空间,适配便携设备(如智能手环、蓝牙耳机)或高密度模块布局;
工作温度范围覆盖**-40℃~+150℃**,宽温特性使其可在工业环境(低温车间、高温设备舱)或极端气候场景下稳定工作,可靠性更高。

四、典型应用场景

结合电气参数与封装特性,该器件适用于以下场景:

  1. 小电流开关控制:小功率LED指示灯驱动、按键开关接口(电平转换/信号放大);
  2. 信号放大调理:光敏/热敏传感器的微弱信号放大,提升至可检测电平;
  3. 逻辑电平转换:实现3.3V与5V电压域的信号匹配,适配不同芯片接口;
  4. 小型负载驱动:驱动小功率继电器线圈(<100mA)、低功耗蜂鸣器等。

五、选型优势总结

  1. 简化电路设计:内置预偏置电阻,无需外部偏置元件,减少元件数量与布线复杂度;
  2. 宽温可靠:-40℃~+150℃覆盖绝大多数应用场景的环境需求;
  3. 小体积高集成:SOT-323封装适配便携、微型设备的高密度布局;
  4. 性能一致性:明确的电气参数(hFE、VI、VO)与内置电阻特性,保证批量应用稳定;
  5. 低功耗高效:200mW耗散功率与低导通压降,适配电池供电设备,延长续航。

DTC123JUA凭借集成化、小体积与宽温特性,成为低功耗电子领域的实用型器件,可有效降低设计成本与空间占用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.