Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YANGJIE E1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- YANGJIE E1G
- Type
- SOD-123
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YANGJIE
- Electronic Component
- E1G
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- 0.037g
- Electronic Component
- 1
- Electronic Component
- BM0231096096
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
E1G 快恢复/高效率二极管（YANGJIE 扬杰）产品概述
一、产品概述
E1G 为扬杰（YANGJIE）推出的独立式快恢复高效率整流二极管，封装为 SOD-123FL。器件在 1A 工作电流下具有典型正向压降 1.3V，直流反向耐压达 400V，兼具低反向泄漏和较快的恢复特性，适合中小功率开关电源与整流场合使用。
二、主要电气参数
- 正向压降 Vf：1.3V @ If = 1A
- 直流反向耐压 Vr：400V
- 连续正向整流电流 If：1A
- 反向电流 Ir：5μA @ Vr = 400V
- 反向恢复时间 Trr：35ns（快恢复特性）
- 非重复峰值浪涌电流 Ifsm：30A（单次冲击）
- 工作结温范围 Tj：-55℃ ~ +150℃
三、器件特性与优势
- 低正向压降：在 1A 条件下 1.3V 的压降可降低功耗与发热，提高整机效率。
- 高耐压设计：400V 反向耐压满足多数离线电源与较高电压工况需求。
- 快速恢复：35ns 的反向恢复时间适用于高频开关场景，减小开关损耗与电磁干扰。
- 低反向泄漏：5μA 的低漏电特性在高压条件下可降低静态功耗，提高可靠性。
- 抗浪涌能力：30A 单次浪涌能力适应通用整流与启动浪涌要求。
四、典型应用
- 开关电源（SMPS）整流与回路整流器
- 适配器与充电器输出整流
- 电机驱动的自由轮二极管与吸收钳位
- LED 驱动电源与高压整流场合
- 通用高压快恢复整流需求
五、封装与热管理
SOD-123FL 小型封装便于表面贴装（SMT），适合高密度 PCB 布局。尽管器件额定为 1A，建议在设计时注意走线宽度和铜厚以改善散热；必要时在 PCB 底层增加散热铜箔或热孔。遵循焊接温度曲线和回流规范可保证焊接可靠性。
六、使用注意事项
- 在高频应用中应考虑并联或更高规格器件以分摊热负荷；避免长期在最大额定电流下工作以延长寿命。
- 对于频繁的大电流冲击场合，应核实 Ifsm 与脉冲能量匹配。
- 储存与焊接时注意防潮防静电，按制造商推荐的焊接条件操作。
E1G 凭借低损耗、快速恢复与高耐压的组合，适用于多类中小功率整流与开关应用，是追求效率和可靠性的工程设计常用选择。若需器件具体封装尺寸、回流曲线或电气特性曲线图，请参照扬杰提供的完整数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
