Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YANGJIE SS520B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- YANGJIE SS520B
- Type
- SMB(DO-214AA)
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YANGJIE
- Electronic Component
- SS520B
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- 0.203g
- Electronic Component
- 1
- Electronic Component
- BM0228274082
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS520B 产品概述
一、产品简介
SS520B 是扬杰（YANGJIE）推出的一款独立式肖特基（Schottky）二极管，采用 SMB（DO-214AA）封装，面向中功率整流与保护场景。器件在 5A 工作电流下正向压降为典型 900mV，直流反向耐压达 200V，具有较高的耐压能力与短时冲击承受能力，适用于开关电源、整流与保护电路等对开关速度和耐压有要求的应用。
二、主要电气参数（典型）
- 类型：肖特基二极管（独立式）
- 正向压降：Vf = 900mV @ IF = 5A
- 直流反向耐压：Vr = 200V
- 连续正向整流电流：IF = 5A
- 反向漏电流：Ir = 100µA @ VR = 200V
- 非重复峰值浪涌电流：Ifsm = 100A
- 工作结温范围：-55℃ ~ +150℃
- 封装：SMB（便于焊接并兼顾散热）
三、性能特点与设计取舍
- 低正向压降：作为肖特基器件，SS520B 在中高电流下仍保持较低的正向压降，有利于降低整流和开关损耗，但在 200V 耐压等级下，900mV 的 Vf 是性能与耐压之间的平衡设计，适合需要更高耐压而仍希望保持较低导通损失的场合。
- 高耐压：200V 的反向耐压使其适用于高电压输入的电源和工业供电系统。
- 漏电控制：反向漏电约 100µA（200V）在高压环境下为可接受范围，但对超低静态功耗系统需谨慎评估。
- 冲击能力：100A 的非重复峰值浪涌电流可应对开机冲击和短时浪涌事件，但长期或重复浪涌需采取保护措施。
四、典型应用场景
- 开关电源（SMPS）输出整流、反并联回收
- AC/DC 适配器、高压整流电路
- 反向保护与极性保护电路
- 电池充电与电源管理模块
- 工业电源、仪器仪表的高压保护路径
五、热管理与布局建议
- SMB 封装需依赖 PCB 铜箔散热，建议使用较大散热焊盘并增加底层过孔以提升热通量。
- 在连续 5A 工作条件下，应评估结温并适当降额；高环境温度时注意按数据手册的结温-电流衰减曲线进行降额设计。
- 布局时尽量缩短高电流回路走线，增大导线宽度，减小寄生电感，有利于降低功耗与电磁干扰。
六、可靠性与选型注意
- 若系统对待机漏电流或静态功耗敏感，应评估 100µA 级别的反向漏电对系统的影响，或选用低漏型器件。
- 频繁或长期承受浪涌时，应配合浪涌抑制器或温度监测机制，避免器件过热失效。
- 选型时结合完整数据手册的温升特性、热阻和浪涌试验条件，以确保在目标工况下长期可靠运行。
总结：SS520B 在 200V 耐压与 5A 连续电流的组合下，提供了兼顾耐压与导通损耗的中高电压整流解决方案。合理的热设计与浪涌保护能充分发挥其性能，适合工业与消费类电源应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
