Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
YANGJIE BZT52C18SQ
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- YANGJIE BZT52C18SQ
- Type
- SOD-323(SC-90)
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YANGJIE
- Electronic Component
- BZT52C18SQ
- Electronic Component
- 1
- Package
- SOD-323(SC-90)
- Electronic Component
- Zener Diode
- Electronic Component
- 0.033g
- Electronic Component
- 1
- (Zzk)
- 225Ω
- (Zzt)
- 45Ω
- Electronic Component
- BM0259581368
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 300mW
- Electronic Component
- 16.8V~19.1V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C18SQ 产品概述
一、产品简介
BZT52C18SQ（扬杰 YANGJIE）是一款小型SMD稳压二极管，封装为SOD-323（SC-90），设计用于低功耗场合提供稳定的参考/钳位电压。标称稳压值为18V，适合对电压精度要求中等且体积受限的电子产品。
二、主要电气参数
- 稳压值（标称）：18V
- 稳压值范围：16.8V ~ 19.1V
- 反向电流 Ir：100 nA @ 12.6V（说明在较低偏压下漏电极小）
- 稳压阻抗 Zzt：45 Ω（在规定测试条件下）
- 低电流阻抗 Zzk：225 Ω（低电流区性能说明）
- 最大耗散功率 Pd：300 mW
- 工作结温范围：-55 ℃ ~ +150 ℃
- 封装：SOD-323（SC-90）
三、主要特性与优势
- 小体积、适配SMD组装，适合自动贴装与回流焊。
- 低反向漏电流，适合对待机功耗敏感的电路。
- 在正常工作点具有较低的阻抗（Zzt=45 Ω），能提供相对稳定的稳压特性；在极低电流时阻抗上升（Zzk=225 Ω），提示低电流区稳压性能下降。
- 耐温范围宽，适应工业级环境。
四、典型应用场景
- 低功耗电源中的电压参照与简易稳压。
- 信号隔离或钳位保护电路。
- 消费电子、仪表、通信终端等需要体积小且成本低的稳压/保护场合。
- ADC/比较器的基准电压源（注意精度要求时需校准或配合后级电路）。
五、使用要点与焊接建议
- 最大耗散功率为300 mW，工作时应避免长期接近上限；热量主要通过引脚和PCB散出，宜在焊盘处增加铜箔面积以改善散热。
- 建议按实际功耗计算并留有余量：在18V稳压下理论最大电流约为300 mW / 18 V ≈ 16.7 mA，但长期应降低负荷并做热沉设计。
- 回流焊时遵循SOD-323封装的温度曲线，避免过热导致封装或焊点损伤。
- 存储与使用时注意防潮、防静电，避免高温长期暴露。
六、设计建议与简单计算
- 稳压电路常用串联电阻与此二极管配合：选择R时需保证在最大输入电压与最小负载条件下二极管电流不超过允许值，并在最大负载时仍维持稳定击穿。
- 阻抗对电压波动的影响：例如在测试条件下，若电路电流变化1 mA，稳压电压的理想变化量约为 ΔV = Zzt × ΔI = 45 Ω × 1 mA = 45 mV；这提示在电流扰动较大时需注意输出电压漂移。
七、可靠性与替代方案
- 产品适用于工业级温度范围，可靠性取决于合理的热管理与电流限制。
- 如需更高精度或更大功率，应选择阻抗更低或功耗更大的型号；在封装上可考虑SOD-123等更利于散热的封装替代。
以上为BZT52C18SQ的概要与应用参考，实际设计中应结合整机电源条件、温升及寿命要求进行详细计算与实验验证。若需基于具体工况的电路设计或替代型号推荐，可提供具体输入电压、负载电流与温度条件以便进一步优化。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
1 Piece M92T36 BGA Integrated Circuit Chipset PI3USB BQ24193 P13USB PI3USB30532ZLE P13USB30532ZLE
- Model
- M92T36
- Package
- UQFN-40-EP(5x5) / WQFN-40-EP(3x6) / VQFN-24-EP(4x4)
(100 Pcs) TPPESD5V0S1BA UDD32C03L01 UDD32C05L01 SOD-323(SC-90)
- Model
- TPPESD5V0S1BA
- Package
- SOD-323(SC-90)
