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YANGJIE MBR10150CD
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- YANGJIE MBR10150CD
- Type
- TO-252
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YANGJIE
- Electronic Component
- MBR10150CD
- Electronic Component
- 1
- Package
- TO-252
- Electronic Component
- 0.45g
- Electronic Component
- 1
- Electronic Component
- BM0263439522
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MBR10150CD 产品概述
一、产品简介
MBR10150CD 是扬杰（YANGJIE）出品的一款肖特基势垒二极管，采用一对共阴极（Dual Common Cathode）配置，封装为 TO‑252（又称 DPAK）。器件额定整流电流为 10A，直流反向耐压 150V，典型正向压降 0.85V（在 10A 测试条件下），非重复峰值浪涌电流达 120A，适用于中高功率整流与防反接场景。
二、主要电气与热参数
- 正向压降 Vf：0.85V @ 10A（低压降有利于降低导通损耗）
- 最大直流反向电压 Vr：150V
- 连续整流电流 Io：10A（需按封装散热条件评估）
- 反向漏电流 Ir：100µA @ 150V（温度升高时漏电随之增大）
- 峰值浪涌电流 Ifsm：120A（用于评估输入浪涌与启动冲击能力）
- 工作结温范围：-55℃ ~ +175℃
三、应用场景
- 开关电源整流、同步降压输出续流二极管
- 充电器、适配器与电源模块的输出整流与反向保护
- 汽车与工业电源中对高耐压、低压降要求的应用（需注意工作温度）
- 电机驱动与功率转换电路的吸收/续流回路
四、封装与散热建议
TO‑252（DPAK）为表面贴装功率封装，需在 PCB 上设计充分的热铜箔与过孔以提高散热能力。长时间 10A 连续工作时，应采用大面积散热铺铜或外接散热器，并考虑热阻、结‑壳与结‑环境温升，按器件规格对结温进行热裕量设计。
五、设计注意事项
- 评估正向压降在 10A 下的功耗（P≈Vf×I），并据此计算 PCB 温升与散热需求。
- 反向漏流随温度显著增加，需在高温环境下验证系统漏电影响。
- 峰值浪涌能力有限，针对启动或浪涌场景需考虑软启动或限流保护。
- 共阴极配置便于多路整流与桥式布局，但并联使用时需注意电流共享与均热。
六、封装与订购信息
品牌：YANGJIE（扬杰）
型号：MBR10150CD
封装：TO‑252（DPAK）
典型应用与样片可向供应商咨询详细数据手册与封装尺寸，以便完成 PCB 布局与可靠性评估。
如需更详细的电气曲线、热阻参数或应用电路范例，我可以基于器件手册提供进一步支持。
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