WMSIC Electronic Components

YANGJIE YJD45G10AQ

ModelYJD45G10AQ
PackageTO-252
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YANGJIE YJD45G10AQ
Type
TO-252
Minimum package
2500

Technical parameters

Electronic Component
YANGJIE
Electronic Component
YJD45G10AQ
Electronic Component
1
Package
TO-252
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.46g
Electronic Component
1
Electronic Component
BM0231132720
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
73W
Electronic Component
2500
Voltage(Vdss)
100V
Capacitor(Ciss)
1.165nF
Output Capacitor(Coss)
265pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YJD45G10AQ 产品概述

一、概述

YJD45G10AQ 是扬杰(YANGJIE)推出的一款车规级 N 沟道功率 MOSFET,设计用于高可靠性汽车及工业电源电子应用。器件额定漏源电压 Vdss=100V,连续漏极电流 Id=45A,工作温度范围宽(-55℃ 到 +150℃),满足车规级严苛的温度与稳定性要求。封装为 TO-252(DPAK),适合表面贴装与散热管理。

二、主要电气参数与特点

  • 漏源耐压:100V(Vdss)
  • 导通电阻:RDS(on)=17mΩ @ Vgs=10V(典型)
  • 连续漏极电流:45A(器件额定,具体取决于散热条件)
  • 耗散功率:Pd=73W(额定,通常在标注的散热条件下测得)
  • 阈值电压:Vgs(th)=2.5V @ Id=250µA(表示不是严格的 5V 逻辑驱动型,要在 10V 驱动下达到标称 RDS(on))
  • 栅极电荷:Qg=19nC @ Vgs=10V(影响驱动器选择与开关损耗)
  • 输入电容:Ciss=1.165nF,输出电容 Coss=265pF,反向传输电容 Crss=8pF(影响开关速度与 dv/dt 灵敏度)
  • 类型:N 沟道,车规级设计

三、性能解读与设计注意事项

  • 导通损耗:在 Vgs=10V 时 RDS(on)=17mΩ,可快速估算导通损耗。例:负载电流 10A 时,Pcond ≈ I^2·R ≈ 1.7W;20A 时约 6.8W;在接近 45A 的高电流下损耗会显著增大(理论上约 34W),需良好散热(查看 Pd 与 PCB/散热器条件)。
  • 开关损耗与驱动:Qg=19nC 表明栅极驱动电荷量中等。近似栅极能量 E ≈ 0.5·Qg·Vgs ≈ 95nJ(Vgs=10V),开关频率越高,栅极驱动功率 Pdrive=E·f 越显著。Ciss/Coss/Crss 指示该器件具备较低输出电容,有利于降低开关过渡时的能量吸收,但仍需适当的门极电阻与驱动器能力以控制 dv/dt 与振铃。
  • 驱动电压:要实现标称 RDS(on),建议采用 10V 门极驱动。若仅以 5V 驱动,RDS(on) 会显著上升,需在应用中验证实际损耗与温升。

四、封装与热管理

TO-252(DPAK) 封装利于表面贴装自动化生产并提供较好的热流通路径。器件 Pd=73W 为在指定散热条件下的额定耗散;实际电路设计需结合 PCB 铜箔面积、过孔散热和散热器设计来保证芯片温度在允许范围内。建议在高电流或连续导通场合使用大铜散热垫并考虑热仿真。

五、典型应用场景与建议

  • 汽车负载开关、车载 DC-DC 升降压转换器、车用电机小功率控制与驱动
  • 工业电源、开关电源(SMPS)、逆变器前端开关或同步整流器
  • 使用建议:短栅极走线、在门极串联适当电阻(以限制电流与抑制振铃)、并在电源侧/负载侧配合 TVS、RC 吸收网络或合适的钳位措施以抑制瞬态过压。对高频切换场合,评估 Coss 引起的开关损耗并考虑软切换或缓冲电路以降低应力。

若需针对具体电路(例如某一电流/频率/散热条件)进行损耗计算、驱动选型或 PCB 布局建议,我可以基于这些参数提供更详细的设计与仿真建议。

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