WMSIC Electronic Components

YANGJIE GBU1010A

ModelGBU1010A
PackageGBU
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

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Technical data

Product details

19 specifications

Core information

Product name
YANGJIE GBU1010A
Type
GBU
Minimum package
20 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
GBU1010A
Electronic Component
1
Package
GBU
Type
Electronic Component
Electronic Component
Bridge Rectifier
Electronic Component
5.7g
Electronic Component
1
Electronic Component
BM0265324204
Current
3.6A
Current(Ir)
5uA@1kV
(Vf)
1V@5A
Electronic Component
55℃~+150℃@(Tj)
Electronic Component
Electronic Component
Electronic Component
20

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

扬杰GBU1010A单相整流桥产品概述

扬杰科技推出的GBU1010A是一款针对中功率单相整流场景设计的通用型整流桥器件,采用标准GBU封装,以低导通损耗、高可靠性为核心优势,广泛适配家电、工业电源、电动车辅助系统等多领域应用需求。

一、产品定位与核心应用场景

GBU1010A定位于中功率通用整流桥,主打“效率优先+抗干扰强”的平衡设计,核心应用覆盖三大典型场景:

  1. 家电电源系统:空调室外机、冰箱变频控制器、洗衣机驱动电源的整流前端,应对日常开机浪涌与连续工作需求;
  2. 工业小功率电源:小型PLC模块、仪器仪表电源、LED工业照明驱动的整流单元,满足宽温环境下的稳定输出;
  3. 电动车辅助系统:两轮电动车充电器、车载低压辅助电源(如车灯、仪表供电)的整流环节,适配户外高低温工况。

二、关键电气参数详解

该器件的核心参数经过针对性优化,关键指标(基于典型工作条件)如下:

  • 正向压降(Vf):1V@5A——采用低损耗芯片工艺,导通损耗比常规整流桥降低约15%,有效减少电源内部发热,提升系统效率;
  • 直流反向耐压(Vr):1kV——满足800V以下工作电压的安全裕量,避免反向击穿风险;
  • 额定整流电流(If):3.6A(直流平均电流)——连续工作电流承载能力稳定,实际应用建议留20%裕量(≤2.88A);
  • 反向漏电流(Ir):5μA@1kV——反向绝缘性能优异,待机状态下漏电损耗可忽略,降低系统待机功耗;
  • 非重复峰值浪涌电流(Ifsm):200A——可承受开机瞬间或负载突变的大电流冲击,无需额外浪涌抑制电路即可应对常规浪涌;
  • 工作结温范围:-55℃~+150℃——覆盖工业级宽温需求,适配低温(如北方户外)与高温(如电源内部)环境。

三、封装与可靠性设计

GBU1010A采用DIP-4引脚的GBU标准封装,设计重点围绕可靠性展开:

  1. 封装材料:使用耐高温环氧树脂,耐温范围-55℃~+175℃,绝缘等级符合UL94 V-0标准,抗机械冲击与化学腐蚀;
  2. 内部结构:内置4颗自主设计的快恢复二极管芯片,芯片布局优化减少寄生电感,提升高频响应能力;
  3. 引脚设计:镀锡处理的铜引脚,抗氧化性能优异,焊接温度≤260℃(10秒内),避免虚焊与冷焊问题;
  4. 散热优化:封装底部与引脚的铜箔连接面积设计合理,PCB布线时可通过增加铜箔面积进一步提升散热效率。

四、选型与应用注意事项

为确保GBU1010A的稳定工作,实际选型与应用需注意以下几点:

  1. 电流裕量:连续工作电流不超过额定值的80%(≤2.88A),若存在脉冲负载需结合占空比计算有效电流;
  2. 电压裕量:反向工作电压建议不超过额定耐压的80%(≤800V),避免过压击穿;
  3. 散热设计:若工作电流接近额定值,需在PCB对应位置增加散热铜箔(建议面积≥10cm²),无需额外散热片;
  4. 浪涌防护:若系统存在频繁大浪涌(如雷击、负载短路),建议并联TVS管(如1.5kV耐压)进一步防护;
  5. 焊接规范:手工焊接温度≤350℃(3秒内),回流焊峰值温度≤245℃,避免热损伤芯片。

GBU1010A凭借平衡的性能与可靠的设计,成为中功率单相整流场景的高性价比选择,适配多行业的通用需求。

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