WMSIC Electronic Components

YANGJIE YJG60G10BQ

ModelYJG60G10BQ
PackagePDFN-8L(5.9x5.2)
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE YJG60G10BQ
Type
PDFN-8L(5.9X5.2)
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
YJG60G10BQ
Electronic Component
1
Package
PDFN-8L(5.9x5.2)
Electronic Component
0.2g
Electronic Component
1
Electronic Component
BM0264356855
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

扬杰YJG60G10BQ N沟道MOSFET产品概述

YJG60G10BQ是扬杰科技针对中高压大电流场景优化的N沟道增强型MOSFET,通过平衡导通损耗与开关特性,结合紧凑封装设计,适配工业级及消费电子的功率转换需求。

一、核心参数总览

该器件的关键参数覆盖直流特性、开关特性及环境适应性,核心指标如下:

  • 电压电流能力:漏源击穿电压(Vdss)100V,25℃下连续漏极电流(Id)达60A,可支撑中功率负载的长期运行;
  • 导通特性:在4.5V典型驱动电压、20A负载下,导通电阻(RDS(on))仅15mΩ,低损耗优势显著;
  • 开关特性:栅极总电荷量(Qg)36nC(Vgs=13V时),输入电容(Ciss)2.5nF、反向传输电容(Crss)45pF(Vds=25V时),开关损耗控制在合理范围;
  • 阈值与温度:栅源阈值电压(Vgs(th))2.8V(典型值),工作温度范围-55℃~+150℃,满足工业级环境要求。

二、封装与工艺特点

YJG60G10BQ采用PDFN-8L(5.9×5.2mm) 封装,具有以下设计优势:

  1. 高密度布局:无引脚平面封装,尺寸仅为传统TO-220封装的1/5左右,大幅节省PCB板空间,适合小型化设备;
  2. 散热优化:封装底部集成大面积散热焊盘,可直接与PCB铜箔焊接,热传导效率提升30%以上,有效降低器件结温;
  3. 工艺支撑:采用扬杰自主沟槽(Trench)工艺,通过优化栅极结构减少导通电阻,同时控制寄生电容,平衡导通与开关损耗。

三、性能优势解析

  1. 低导通损耗提升效率:15mΩ的RDS(on)在4.5V驱动下即可实现,20A负载时导通损耗为6W(I²R=20²×0.015),相比同等级器件损耗降低约12%,可将电源转换效率提升至90%以上;
  2. 宽驱动电压兼容:2.8V的低阈值电压,支持4.5V~15V的驱动范围,可直接由MCU、GPIO或简单驱动电路控制,无需额外升压模块,简化系统设计;
  3. 开关特性平衡:36nC的Qg处于中低水平,结合适中的Ciss/Crss,可在100kHz~500kHz的开关频率下保持低损耗,适配高频DC-DC转换器;
  4. 大电流可靠性:25℃下连续60A电流能力,配合-55℃~+150℃宽温范围,可在高负载场景下长期稳定运行,避免过热失效。

四、典型应用场景

YJG60G10BQ的性能参数适配多种中高压大电流场景:

  1. 中功率开关电源:100W~600W的AC-DC适配器、DC-DC升压/降压模块,低损耗可满足能效要求;
  2. 电池管理系统(BMS):电动自行车、小型储能系统的充放电控制、电池保护电路,大电流能力适配快充需求;
  3. 电机驱动:小型直流电机、BLDC电机的驱动电路,如扫地机器人、小型工业电机的调速控制;
  4. 负载开关:服务器、工业控制器的电源路径切换,PDFN封装适合高密度板级设计。

五、可靠性与环境适应性

该器件满足工业级可靠性要求:

  • 宽温适配:-55℃~+150℃的温度范围,可覆盖高寒、高温等恶劣环境;
  • 封装抗扰:PDFN-8L封装抗振动、抗冲击性能优异,适合车载、工业设备等振动场景;
  • 质量验证:通过扬杰ESD(HBM 2kV)、温湿度循环(-40℃~+85℃)等可靠性测试,确保长期使用稳定性。

综上,YJG60G10BQ凭借平衡的性能参数、紧凑封装及工业级可靠性,成为中高压大电流MOSFET应用的高性价比选择,可有效简化系统设计并提升功率转换效率。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.