WMSIC Electronic Components

YANGJIE GBU1010

ModelGBU1010
PackageGBU
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
YANGJIE GBU1010
Type
GBU
Minimum package
20 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
GBU1010
Electronic Component
1
Package
GBU
Electronic Component
5.8g
Electronic Component
1
Electronic Component
BM0230005012
Electronic Component
Electronic Component
Electronic Component
20

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GBU1010 — 单相桥式整流器产品概述

一、产品概述

GBU1010 是扬杰(YANGJIE)出品的一款单相桥式整流器,采用 GBU 桥式封装,适用于中高压交流到直流的整流场合。该器件设计用于承受高反向电压并提供稳定的整流输出,常用于电源模块、充电器、适配器及工业控制电路中。

二、主要电气参数

  • 正向压降(Vf):1.0 V @ 5 A(典型条件下)
  • 直流反向耐压(VRRM):1000 V(1 kV)
  • 额定整流电流:10 A(整流桥额定值)
  • 反向漏电流(Ir):≤5 μA @ 1 kV
  • 非重复峰值浪涌电流(Ifsm):175 A
  • 工作结温范围:-55 ℃ ~ +150 ℃
    说明:资料中亦出现“3.2 A”这一数值,可能为在特定环境或封装散热条件下的允许连续工作电流或某一测试条件下的典型值。选型时应以厂家完整规格书为准,并根据实际散热条件做降额处理。

三、结构与封装

GBU 系列为桥式整流专用封装,外形紧凑,四引脚布局便于焊接与安装,适合通过孔或贴装在带绝缘板的散热体上。封装耐热性良好,配合良好的散热设计可在高温环境下长期工作。了解具体引脚定义与外形尺寸请参考厂方机械图纸。

四、热特性与可靠性

该器件工作结温范围宽,适应工业级温度要求。但整流器的允许平均电流与结温、环境温度和散热条件密切相关;随温度升高,正向压降和反向泄漏电流均会增加。因此在高电流或高温场合应配合合适散热器、良好通风或在电路中采取过流保护与热关断策略以提高可靠性。Ifsm 指出器件能承受短时浪涌,但不宜将此作为长期过载手段。

五、典型应用场景

  • 开关电源与线性电源整流环节
  • 工业电源、控制器和驱动电源
  • 医疗电源与测试设备(在满足隔离与漏电标准时)
  • 充电器、逆变器及备用电源系统
    该款器件在需要高耐压且对反向漏流有严格要求的场合尤为合适。

六、使用建议与注意事项

  • 散热设计:建议按额定电流并结合环境工况选择散热器或增加铜箔面积,必要时采用热界面材料提高导热性。
  • 耐压裕量:在实际电路中建议留有一定耐压裕量,考虑浪涌、电网脉冲及瞬态过压。
  • 漏电管理:1 kV 下反向漏电流 ≤5 μA,但漏电随温度和电压上升,敏感应用需评估实际温度下的泄漏水平。
  • 浪涌保护:虽然 Ifsm 可承受短时浪涌,但应使用限流器、熔断器或浪涌抑制器保护器件与系统。
  • 验证资料:在最终设计前,请取得扬杰官方规格书与封装图,对关键参数(如3.2 A 项)做确认并按规格书进行热仿真与试验验证。

七、结论与选型提示

GBU1010 以其 1 kV 的耐压、较低的正向压降和较小的反向漏电流,适合用于中高压整流应用。若系统工作在高温或连续大电流条件下,请重点考虑散热与降额;如对漏电流、体积或浪涌能力有更严格要求,可与同系列或其它封装的型号进行对比,选取最适合的器件并以厂方数据为准。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.