WMSIC Electronic Components

YANGJIE MMBT5551Q

ModelMMBT5551Q
PackageSOT-23
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YANGJIE MMBT5551Q
Type
SOT-23
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
MMBT5551Q
Electronic Component
1
Package
SOT-23
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0230875409
Electronic Component
Electronic Component
Electronic Component
3000
models
MMBT5551Q
version
1
prompt_id
15
package_id
42
image_model
gpt-image-2.5-flare
master_path
chengming/packages/42/cm-master-zh/e74d8c7408a72be1112592afb09f1ab1bc8c386755136c62d0329761e186f161.png

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBT5551Q 产品概述

一、产品简介

MMBT5551Q 是一款车规级高压小信号 NPN 双极型晶体管(普通三极管),由 YANGJIE(扬杰)生产,采用 SOT-23(TO-236)小封装,单只器件(数量:1 个 NPN)。器件专为需要高击穿电压与开关/放大兼顾的汽车与工业电子应用设计,工作温度范围宽(-55℃~+150℃),适应苛刻环境。

二、主要规格参数

  • 晶体管类型:NPN(双极型)
  • 封装:SOT-23(TO-236)
  • 直流电流增益 (hFE):80(测试条件 Ic=1.0mA,VCE=5.0V)
  • 最大集电极电流 (Ic):600mA(请参照器件数据手册的脉冲/连续限制)
  • 集电极——射极击穿电压 (VCEo):160V
  • 射基极击穿电压 (Vebo):6V
  • 集电极截止电流 (ICBO):50nA
  • 特征频率 (fT):300MHz
  • 集电极–射极饱和电压 VCE(sat):典型 200mV(示例测试条件 Ic=50mA, Ib=5mA)
  • 耗散功率 (Pd):300mW(封装热极限,注意散热与降额)
  • 工作温度范围:-55℃~+150℃

三、关键特性与优点

  • 高压能力:160V 的 VCEo 使得 MMBT5551Q 可以用于较高电压场合的开关和级间隔离。
  • 高频性能:fT 约 300MHz,适合高频信号放大与快速开关应用。
  • 低漏电:ICBO 典型值仅 50nA,有利于高阻抗电路和低静态功耗设计。
  • 低饱和压:在中等电流(示例 50mA)下 VCE(sat) 可达 200mV,提升开关效率并降低功耗。
  • 宽温度范围与车规级:-55℃~+150℃ 满足汽车与工业级可靠性需求。

四、典型应用场景

  • 汽车电子:传感器驱动、接口级开关、继电器驱动的前端级。
  • 工业控制:高压驱动、隔离放大与电平移位。
  • 通信与高频电路:小信号放大器、射频前端(依据实际频响与增益要求)。
  • 通用开关与缓冲:低电压数字电路的电流放大或拉低驱动。

五、使用与布板建议

  • 热管理:SOT-23 封装的 Pd 为 300mW,建议靠近散热平面或增加铜箔面积,避免连续高功耗工况下过热。
  • 引脚连接:封装为三引脚 B/C/E(基极/集电极/射极),使用时请参照厂方数据手册确认引脚定义并合理配置基极限流电阻以控制基极电流。
  • 降额设计:尽量避免长期满额定 Ic 与 Pd 条件工作,推荐在高温或连续工作下适当降额。
  • 抗浪涌与保护:在汽车工况中建议配合浪涌抑制元件(TVS、限流电阻等)保护基极与集电极免受瞬态过压冲击。
  • PCB 布局:短而粗的走线连接集电极和射极,基极走线加串联电阻以稳定开关,避免寄生振荡,必要时在基极并联小电容进行频率补偿。

六、可靠性与质量等级

本器件为车规级设计,温度范围与工艺控制适合长期在严苛环境下使用。出货前建议参考 YANGJIE 的可靠性试验(如温度循环、高温储存、湿热试验)与批次认证,以满足系统级的质量要求。

七、包装与订购信息

  • 品牌:YANGJIE(扬杰)
  • 单位包装:SOT-23 封装的小体积器件,适合自动贴片生产线。
  • 订购注意事项:请在采购时确认器件完整型号(MMBT5551Q)、批号与生产批次,并索取最新数据手册以获取完整电气特性曲线与封装引脚图。

如需电路示例、引脚图或器件的详细温度/频率特性曲线,可告知具体应用场景,我可提供匹配的电路拓扑与计算建议。

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