WMSIC Electronic Components

YANGJIE MMBT5551

YANGJIE MMBT5551
1 / 2

Product image

ModelMMBT5551
PackageSOT-23
BrandYANGJIE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

19 specifications

Core information

Product name
YANGJIE MMBT5551
Type
SOT-23
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YANGJIE
Electronic Component
MMBT5551
Electronic Component
1
Package
SOT-23
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0221188080
Electronic Component
Electronic Component
Electronic Component
3000
models
MMBT5551
version
1
prompt_id
15
package_id
42
image_model
gpt-image-2.5-flare
master_path
chengming/packages/42/cm-master-zh/e74d8c7408a72be1112592afb09f1ab1bc8c386755136c62d0329761e186f161.png

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBT5551 产品概述

一、产品简介

MMBT5551是一款高性能的NPN型小信号三极管，广泛应用于多种电子电路中。它拥有300 mW的功率处理能力，最高工作电压为160 V，具有600 mA的集电极电流输出能力。采用SOT-23（TO-236）封装，体积小、便于集成，适合各种空间有限的应用场合。

二、技术特性

  1. 电气参数：

    • 最大集电极电压（Vce）：160 V，适用于高电压应用。
    • 最大集电极电流（Ic）：600 mA，能够满足较高的负载需求。
    • 功耗（Pd）：300 mW，适合一般功率的信号放大和开关应用。

  2. 封装特点：

    • 封装类型：SOT-23，这种表面贴装封装形状紧凑，有助于提高电路的集成度，减小占板面积。

  3. 工作温度范围：

    • MMBT5551的工作温度范围从-55°C到150°C，能够在苛刻环境下稳定工作，适合汽车电子、工业设备等应用。

  4. 极性与结构：

    • 作为NPN三极管，MMBT5551的主要电流是从集电极流向发射极，可用于信号放大、开关控制等操作。

三、应用场景

MMBT5551广泛应用于以下几个领域：

  1. 信号放大器：

    • 由于其高集电极电压和适中的功耗，MMBT5551可作为小信号放大器，常用于音频设备、电信设备等。

  2. 开关电路：

    • 该三极管能够用于开关电源，特别在小型电源模块中，因其良好的开关性能和较高的集电极电流，能够高效控制电流的流动。

  3. 有源滤波器：

    • 在音频或射频电路中，MMBT5551可以作为有源滤波器中的放大器，以净化信号和消除杂音。

  4. 汽车电子：

    • 考虑到其工作温度范围和电压参数，MMBT5551适合于汽车内部的各种电子控制单元，如发动机控制、车载通信等。

  5. 其他消费电子产品：

    • 例如家用电器、家居智能设备等，MMBT5551的尺寸和性能使其成为多种应用的理想选择。

四、安装与使用建议

  1. 焊接注意事项：

    • MMBT5551采用SOT-23封装，焊接过程应注意温度控制，防止因过热而损坏器件。推荐使用焊接温度在260°C以下，并且焊接时间应控制在3至5秒内。

  2. 电路设计考量：

    • 在设计电路时，要确保各项参数都在器件的额定范围内，尤其是在进行高电压或高电流应用时，需要采取适当的保护措施，如电压钳制器、限流电阻等。

  3. 散热设计：

    • 尽管MMBT5551的功耗不高，但在高功率密度的电路中，适当的散热设计仍然是必要的，以确保器件长期稳定运行。

五、总结

MMBT5551作为一款高性能的小信号NPN三极管，以其出色的电气特性和小巧的封装，广泛适用于各类现代电子设备，从汽车电子、消费电子到工业控制等多种领域。为了保证最佳性能，设计者在使用时需要特别关注安装、使用及保护中的细节问题，使得MMBT5551能够在各种应用中发挥出其最大的效能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.